Lista de sistemas Qualcomm Snapdragon en chips
Smartphone electronics product line

Qualcomm Snapdragon
información general
Lanzado2007 ; hace 17 años (2007)
Diseñado porQualcomm
Arquitectura y clasificación
SolicitudSoC móvil y PC 2 en 1
MicroarquitecturaARM9 , ARM11 , ARM Cortex-A , Cortex-X1 , Cortex-X2 , Cortex-X3 , Cortex-X4 , Scorpion , Krait , Kryo , Oryon
Conjunto de instruccionesARMv6 , ARMv7-A , ARMv8-A , ARMv9-A
Especificaciones físicas
Núcleos
  • 1, 2, 4, 6 u 8

Esta es una lista de sistemas Qualcomm Snapdragon en chips (SoC) fabricados por Qualcomm para su uso en teléfonos inteligentes , tabletas , computadoras portátiles , PC 2 en 1 , relojes inteligentes y dispositivos smartbooks .

Antes de Snapdragon

SoC fabricado por Qualcomm antes de que cambiara su nombre a Snapdragon. [1]

Número de modelofabulosoUPCGPU (o núcleo Gfx)ConectividadDisponibilidad de muestras
QSC1xxx
QSC1100Cuarto trimestre de 2007
QSC6xxx
QSC6010ARMv5TEJ ARM926EJ-S [ cita requerida ]Sin 3D y ARM 2DNinguno2006
QSC6020
QSC6030
QSC6240HSDPATercer trimestre de 2007
QSC6245-1HSDPATercer trimestre de 2007
QSC6055Primer trimestre de 2007
QSC6065HSDPASegundo trimestre de 2007
QSC6260-1Tercer trimestre de 2007
QSC6270HSDPA
QSC6075Segundo trimestre de 2007
QSC6085DOrACuarto trimestre de 2007
MSM6xxx
MSM6000Ninguno2006
MSM6025
MSM6050
MSM6100ARM-DSP 3D y ARM 2D
MSM6125
MSM6150Defender2 3D y ARM 2D
MSM6175
MSM6225Sin 3D y ARM 2DHSDPA
MSM6250ARM-DSP 3D y ARM 2DAcceso a Internet móvil (WCDMA)2006
MSM6250ASin 3D y ARM 2DAcceso a Internet móvil (WCDMA)
MSM6245CUÑA
MSM6255A
MSM6260ARMv5TEJ ARM926EJ-S a 225 MHz [2]ARM-DSP 3D y ARM 2DHSUPA
MSM6275Defender2 3D y ARM 2D
MSM6280
MSM6280AStargate 3D y ARM 2D2007
MSM6800ADefender3 3D y ARM 2DDOrA2006
MSM6575DOr0
MSM6550ARMv5TEJ ARM926EJ-S a 225 MHz [3]Defender2 3D y ARM 2D
MSM6550A
MSM6800DOrA
MSM6500ARMv5TEJ ARM926EJ-S a 150 MHz [4]ARM-DSP 3D y ARM 2DDOr0
MSM7xxx
MSM7200Imagen en 3D

Imagen en 2D

HSUPA2006
MSM7200AARM11 a 528 MHzPrimer trimestre de 2007
MSM7201 [5] [6]2008
MSM7500DOrA2006
MSM7500ACuarto trimestre de 2007
MSM760065 nmARM1136J-S a 528 MHz [5] [6]HSUPA y DOrAPrimer trimestre de 2007
MSM7850LT 3D y LT 2DDORB2008

Serie S de Snapdragon

Características destacables del Snapdragon S1 respecto a su predecesor (MSM7xxx):

Número de modelofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
MSM7225 [8]65 nm1 núcleo hasta 528  MHz ARM11 ( ARMv6 ):  caché L1 de 16K+16K , sin  caché L2Soporte para renderizado 2D por software (HVGA)Hexágono QDSP5 320 MHzCámara de hasta 5 MPLPDDR de un solo canal, 166 MHz (1,33 GB/s)UMTS ( HSPA ); GSM ( GPRS , EDGE )Bluetooth 2.0/2.1 (BTS4025 externo); 802.11b/g/n (WCN1314 externo); gpsOne Gen 7; USB 2.02007
MSM7625 [8]CDMA (1× Rev. A, 1× EV-DO Rev. A); UMTS ; GSM
MSM7227 [8]1 núcleo hasta 800 MHz ARM11 ( ARMv6 ): 16K+16K  caché L1 , 256K  caché L2Adreno 200 226 MHz (FWVGA)Cámara de hasta 8 MPLPDDR de un solo canal, 166 MHz (1,33 GB/s)UMTS ; GSMBluetooth 2.0/2.1 (BTS4025 externo); 802.11b/g/n (WCN1312 externo); gpsOne Gen 7; USB 2.02008
MSM7627 [8]CDMA / UMTS ; GSM
MSM7225A [8]45 nm1 núcleo hasta 800 MHz Cortex-A5 ( ARMv7 ): 32K+32K  caché L1 , 256K  caché L2Adreno 200 245 MHz (HVGA)Hexágono QDSP5 350 MHzCámara de hasta 5 MPLPDDR de un solo canal de 200 MHz (1,6 GB/s)UMTS ( HSDPA , HSUPA , W-CDMA ), MBMS ; GSMBluetooth 4.0 (WCN2243 externo); 802.11b/g/n (AR6003/5 externo, WCN1314); gpsOne Gen 7; USB 2.0Cuarto trimestre de 2011
MSM7625A [8]CDMA2000 (1×RTT, 1× EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM
MSM7227A [8]1 núcleo hasta 1  GHz Cortex-A5 ( ARMv7 ): 32K+32K  caché L1 , 256K  caché L2Adreno 200 245 MHz (FWVGA)Cámara de hasta 8 MPUMTS , MBMS ; GSM
MSM7627A [8]CDMA2000 /UMTS, MBMS; GSM
MSM7225AB [8] [9] [10]UMTS : hasta 7,2 Mbit/s, MBMS ; GSM
QSD8250 [8]65 nm1 núcleo hasta 1 GHz Scorpion ( ARMv7 ): 32K+32K  caché L1 , 256K  caché L2Adreno 200 226 MHz (WXGA)Hexágono QDSP6 600 MHzCámara de hasta 12 MPLPDDR Canal único 400 MHzUMTS , MBMS ; GSMBluetooth 2.0/2.1 (BTS4025 externo); 802.11b/g/n (AR6003 externo); gpsOne Gen 7; USB 2.0Cuarto trimestre de 2008
QSD8650 [8]CDMA2000 /UMTS, MBMS; GSM

Características destacables del Snapdragon S2 respecto a su predecesor (Snapdragon S1):

  • Función de CPU
    • 1 núcleo hasta 1,5 GHz Scorpion
    • ARMv7 (desde ARMv6 en algunos modelos)
    • Hasta 384K  L2
  • Características de la GPU
    • Adreno 205 (Desde software renderizado o Adreno 200)
      • Hasta 266 MHz
      • Hasta 2 veces más rápido que Adreno 200 [11]
      • Rendimiento relativo hasta x2 en OpenGL ES 2.0 desde Adreno 200 [12]
      • Hasta XGA
      • OpenGL ES 2.0
      • SVGT 1.2 [13]
      • OpenVG 1.1
      • Sorteo directo
      • GDI
      • CPU, DSP, gráficos y MDP concurrentes [13]
  • Características de la memoria
    • Hasta LPDDR2 32 bit Canal dual 333 MHz (5,3 GB/s)
  • Características del DSP
  • Tecnología de fabricación de 45 nm
  • 904 pines [14]
Número de modelofabulosoProcesador central ( ARMv7 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
MSM7230 [8]45 nm1 núcleo hasta 800 MHz Scorpion : 32K+32K L1, 256K L2Adreno 205 266 MHz ( XGA )Hexágono QDSP5 256 MHzCámara de hasta 12 MPLPDDR2 32 bit Canal dual 333 MHz (5,3 GB/s) [15]UMTS (HSDPA, HSUPA, HSPA+ , W-CDMA), MBMS; GSM (GPRS, EDGE)Bluetooth 4.0 (WCN2243 externo) o Bluetooth 3.0 (QTR8x00 externo); 802.11b/g/n (WCN1314 externo); gpsOne Gen 8 con GLONASS; USB 2.0Segundo trimestre de 2010
MSM7630 [8]CDMA2000 (1×Adv, [16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM
APQ8055 [8]1 núcleo hasta 1,4 GHz Scorpion : 32K+32K L1, 384K L2—
MSM8255 [8]1 núcleo hasta 1 GHz Scorpion : 32K+32K L1, 384K L2UMTS, MBMS; GSM
MSM8655 [8]CDMA2000/UMTS, MBMS; GSM
MSM8255T [8]1 núcleo hasta 1,5 GHz Scorpion : 32K+32K L1, 384K L2UMTS, MBMS; GSM
MSM8655T [8]CDMA2000/UMTS, MBMS; GSM

Características destacables del Snapdragon S3 respecto a su predecesor (Snapdragon S2):

  • Función de CPU
    • 2 núcleos hasta 1,7 GHz Scorpion
    • 512 KB Nivel 2
  • Características de la GPU
    • Adreno 220
      • Hasta 4 veces más rápido que Adreno 200 [11]
      • Rendimiento relativo hasta x5 en OpenGL ES 2.0 desde Adreno 200 [12]
      • EGL 1.3 (A partir de 1.2) [13]
      • Caché L2 dos veces más grande (512 KB en lugar de 256 KB)
      • Hasta WXGA+
  • Características del DSP
  • Características del ISP
    • Cámara de hasta 16 MP (desde 12 MP)
  • Tecnología de fabricación de 45 nm
Número de modelofabulosoProcesador central ( ARMv7 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
APQ8060 [8]45 nm2 núcleos hasta 1,7 GHz Scorpion : 512 KB L2Adreno 220 266 MHz (WXGA+)Hexágono QDSP6 400 MHzCámara de hasta 16 MPLPDDR2 de un solo canal a 333 MHz (2,67 GB/s) [17]—Bluetooth 4.0 (WCN2243 externo); 802.11b/g/n (WCN1314 externo); gpsOne Gen 8 con GLONASS; USB 2.02011
MSM8260 [8]UMTS (HSDPA, HSUPA, HSPA+, W-CDMA ), MBMS ; GSM ( GPRS , EDGE )Tercer trimestre de 2010
MSM8660 [8]CDMA2000 (1×Adv, [16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS , MBMS ; GSM

Snapdragon S4 se ofrece en tres modelos: S4 Play para dispositivos económicos y de nivel de entrada, S4 Plus para dispositivos de gama media y S4 Pro para dispositivos de gama alta. [18] Se lanzó en 2012.

Los Snapdragon S4 fueron reemplazados por las series Snapdragon 200/400 (S4 Play) y 600/800 (S4 Plus y S4 Pro)

Snapdragon S4 Juego

Número de modelofabulosoProcesador central ( ARMv7 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
MSM8225 [18]45 nm2 núcleos hasta 1,2 GHz Cortex-A5 : 2x 32K+32K L1, 512K L2Adreno 203 320 MHz (FWVGA)HexágonoCámara de hasta 8 MPLPDDR2 de un solo canal, 300 MHzUMTS ( HSPA ); GSM ( GPRS , EDGE )Bluetooth 3.0 (externo); 802.11b/g/n 2,4 GHz (externo); GPS: IZat Gen 7; USB 2.01er semestre de 2012
MSM8625 [18]CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS ; GSM

Snapdragon S4 Plus

Snapdragon S4 plus características destacables respecto a su predecesor (Snapdragon S3):

Número de modelofabulosoProcesador central ( ARMv7 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
MSM8227 [18]28 nm2 núcleos hasta 1 GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2Adreno 305 320MHz (FWVGA / 720p)Hexágono QDSP6LPDDR2 de un solo canal, 400 MHzUMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE)Bluetooth 4.0; 802.11b/g/n (2,4/5 GHz); GPS: IZat Gen8A; USB 2.02do semestre de 2012
MSM8627 [18]CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS ; GSM
APQ8030 [18]2 núcleos hasta 1,2 GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2Adreno 305 400 MHz (QHD/1080p)Cámara de hasta 13,5 MPLPDDR2 de un solo canal, 533 MHz—3T 2012
MSM8230 [18]Sistemas de comunicaciones móviles (UMTS); GSM
MSM8630 [18]CDMA/UMTS; GSM
MSM8930 [18]Modo mundial (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM)
APQ8060A [18]2 núcleos hasta 1,5 GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2Adreno 225 400 MHz (WUXGA/1080p)Cámara de hasta 20 MPLPDDR2 de doble canal de 500 MHz—2do semestre de 2012
MSM8260A [18]Sistemas de comunicaciones móviles (UMTS); GSMPrimer trimestre de 2012
MSM8660A [18]CDMA/UMTS; GSM
MSM8960 [18] [20]Modo mundial (LTE Cat 3)

Snapdragon S4 Pro y Snapdragon S4 Prime (2012)

Características destacables del Snapdragon S4 Pro respecto a su predecesor (Snapdragon S4 Play):

  • Características de la CPU
    • Hasta 2 núcleos Krait  300 de hasta 1,7 GHz en Snapdragon S4 Pro
    • Hasta 4 núcleos Krait  300 de hasta 1,5 GHz en Snapdragon S4 Prime
    • 4+4 KB Nivel 0, 16+16 KB Nivel 1, 1 MB Nivel 2
  • Características de la GPU
  • Características del DSP
  • Características del ISP
    • Cámara de hasta 20 MP
  • Funciones de módem e inalámbricas
    • LTE FDD/TDD Cat 3 o externo en algunos modelos
  • Tecnología de fabricación de LP de 28 nm
  • Hasta eMMC 4.4/4.4.1
Número de modelofabulosoProcesador central ( ARMv7 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadDisponibilidad de muestras
MSM8260A Pro [18]28 nm (TSMC 28LP)2 núcleos hasta 1,7 GHz Krait  300: 4+4 KB L0, 16+16 KB L1, 1 MB L2Adreno 320 400 MHz (WUXGA / 1080p)Hexágono QDSP6Cámara de hasta 20 MPLPDDR2 de doble canal de 500 MHzUMTS ( DC-HSPA+ , TD-SCDMA); GSM (GPRS, EDGE)Bluetooth 4.0; 802.11b/g/n (2,4/5 GHz); GPS: IZat Gen8A; USB 2.0
MSM8960T [18]Modo mundial (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM)Segundo trimestre de 2012
MSM8960T Pro (MSM8960AB [21] ) [18]
MSM8960DT [18] [22]2 núcleos hasta 1,7 GHz Krait  300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; procesador de lenguaje natural y procesador contextualTercer trimestre de 2013
APQ8064 [18] [20]4 núcleos hasta 1,5 GHz Krait : 4+4 KB L0, 16+16 KB L1, 2 MB L2Adreno 320 400 MHz (QXGA/1080p)LPDDR2 de doble canal de 533 MHz [23]Externo2012

Serie Snapdragon 2

La serie Snapdragon 2 es el SoC de nivel de entrada diseñado para teléfonos inteligentes de gama baja o ultra económicos. Reemplaza al modelo MSM8225 S4 Play como el SoC de gama más baja de toda la línea Snapdragon.

Serie Snapdragon 200 (2013-2019)

El Snapdragon 200 se anunció en 2013.
El Snapdragon 208 y el Snapdragon 210 se anunciaron el 9 de septiembre de 2014. [24]
El Snapdragon 212 se anunció el 28 de julio de 2015. [25]
La plataforma móvil Qualcomm 205 cae formalmente bajo la marca de plataforma móvil, pero es prácticamente un Snapdragon 208 con un módem X5 LTE. Se anunció el 20 de marzo de 2017. [26]
El Qualcomm 215 se anunció el 9 de julio de 2019. [27] Es una variante atenuada del Snapdragon 425 y está optimizada principalmente para dispositivos Android Go Edition .

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
MSM8225Q [28]Snapdragon 20045 nm (TSMC 45LP)4 núcleos hasta 1,4 GHz Cortex-A5Adreno 203 400 MHz (12,8 GFLOPS en FP32)Hexágono QDSP5Cámara única de hasta 8 MPLPDDR2 de un solo canal a 333 MHzGobi 3G (UMTS: HSPA; GSM: GPRS/EDGE)Bluetooth 4.1; 802.11b/g/n 2,4 GHz; GPS: IZat Gen8B; USB 2.0—2013
MSM8625Q [28]Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM)
MSM8210 [28] [29]28 nm (TSMC 28LP)2 núcleos hasta 1,2 GHz Cortex-A7Adreno 302 400 MHz (12,8 GFLOPS en FP32)Hexágono QDSP6Gobi 3G (UMTS; GSM)
MSM8610 [28] [29]Gobi 3G (CDMA/UMTS; GSM)
MSM8212 [28] [29]4 núcleos hasta 1,2 GHz Cortex-A7Gobi 3G (UMTS; GSM)
MSM8612 [28] [29]Gobi 3G (CDMA/UMTS; GSM)
MSM8905 [30]Qualcomm 2052 núcleos hasta 1,1 GHz Cortex-A7Adreno 304 400 MHz (19,2 GFLOPS en FP32)Hexágono 536Cámara única de hasta 3 MPLPDDR2 / 3 Monocanal 384 MHzX5 LTE (Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)Bluetooth 4.1 + BLE, 802.11n (2,4 GHz)4.02017
MSM8208 [31]Snapdragon 208Cámara única de hasta 5 MPLPDDR2 / 3 Monocanal 400 MHzGobi 3G (multimodo CDMA/UMTS: descarga hasta 42 Mbit/s; GSM)2.02014
MSM8909 [32]Snapdragon 2104 núcleos hasta 1,1 GHz Cortex-A7Cámara única de hasta 8 MPLPDDR2 / 3 Monocanal 533 MHzX5 LTE
MSM8909AA [33]Snapdragon 2124 núcleos hasta 1,3 GHz Cortex-A72015
QM215 [34]Qualcomm 2154 núcleos hasta 1,3 GHz Cortex-A53Adreno 308 485 MHz (23,3 GFLOPS en FP32)HexágonoCámara única de hasta 13 MP / cámara dual de 8 MPLPDDR3 Monocanal 672 MHz 3 GBX5 LTE (Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)Bluetooth 4.2, NFC, Wi-Fi 802.11ac, Beidou, GPS, GLONASS, USB 2.01.0Tercer trimestre de 2019

Serie Snapdragon 4

El Snapdragon Serie 4 es el SoC de gama de entrada diseñado para el segmento de gama de entrada más exclusivo, a diferencia del Serie 2, que estaba dirigido al segmento de gama ultra económica. Al igual que el Serie 2, es el sucesor del S4 Play.

Serie Snapdragon 400 (2013-2021)

El Snapdragon 400 fue anunciado en 2013.
El Snapdragon 410 fue anunciado el 9 de diciembre de 2013. [35] Fue el primer sistema móvil de 64 bits de Qualcomm en un chip y fue fabricado por primera vez en China por SMIC . [36]
El Snapdragon 412 fue anunciado el 28 de julio de 2015. [25]
El Snapdragon 415 y el antiguo Snapdragon 425 (posteriormente cancelado) fueron anunciados el 18 de febrero de 2015. [37]
Snapdragon 425, 427, 430 y 435 son compatibles con PIN y software; software compatible con Snapdragon 429, 439, 450, 625, 626 y 632.
El Snapdragon 430 fue anunciado el 15 de septiembre de 2015. [38]
Los nuevos Snapdragon 425 y Snapdragon 435 fueron anunciados el 11 de febrero de 2016. [39]
El Snapdragon 427 fue anunciado el 18 de octubre de 2016. [40] [41]
El Snapdragon 450 fue anunciado el 28 de junio de 2017. [42] Pin y software compatibles con Snapdragon 625, 626 y 632; software compatible con Snapdragon 425, 427, 429, 430, 435 y 439.
El Snapdragon 429 y 439 fueron anunciados el 26 de junio de 2018. [43] Compatibilidad de pin y software de Snapdragon 429 y 439; Software compatible con Snapdragon 425, 427, 430, 435, 450, 625, 626 y 632.
El Snapdragon 460 se anunció el 20 de enero de 2020, con soporte NavIC . Es el primer modelo Snapdragon 400 que incorpora la arquitectura Kryo . [44]
El Snapdragon 480 se anunció el 4 de enero de 2021 y es el primer SoC de la serie Snapdragon 4 de Qualcomm que admite la conectividad 5G. [45]
El Snapdragon 480+ se anunció el 26 de octubre de 2021. [46]

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
APQ8026 [47]Snapdragon 40028 nm (TSMC 28LP)4 núcleos hasta 1,2 GHz Cortex-A7 : 32 KB L1, 512 KB L2Adreno 305 400 MHz (19,2 GFLOPS en FP32)Hexágono QDSP6Cámara única de hasta 13,5 MPLPDDR2 / 3 Monocanal 533 MHz—Bluetooth 4.0, 802.11 b/g/n, IZat GNSS integrado1.02013
MSM8226 [47]Gobi 3G (UMTS: HSPA+ hasta 21 Mbit/s; GSM: GPRS/EDGE)
MSM8626 [47]Gobi 3G (CDMA/UMTS)
MSM8926 [47]Gobi 4G (LTE Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)
APQ8028 [47]4 núcleos hasta 1,6 GHz Cortex-A7 : 32 KB L1, 512 KB L2Adreno 305 450 MHz (21,6 GFLOPS en FP32)—
MSM8228 [47]Gobi 3G (UMTS)
MSM8628 [47]Gobi 3G (CDMA/UMTS)
MSM8928 [47]Gobi 4G (LTE categoría 4)
MSM8230 [47]2 núcleos hasta 1,2 GHz Krait  200: 32 KB L1, 1 MB L2Adreno 305 400 MHz (19,2 GFLOPS en FP32)LPDDR2 de un solo canal, 533 MHzGobi 3G (UMTS)
MSM8630 [47]Gobi 3G (CDMA/UMTS)
MSM8930 [47]Gobi 4G (LTE categoría 4)
MSM8930AA [47]2 núcleos hasta 1,4 GHz Krait  300: 32 KB L1, 1 MB L2Gobi 4G (LTE categoría 4)
APQ8030AB [47]2 núcleos hasta 1,7 GHz Krait  300: 32 KB L1, 1 MB L2Adreno 305 450 MHz (21,6 GFLOPS en FP32)—
MSM8230AB [47]Gobi 3G (UMTS)
MSM8630AB [47]Gobi 3G (CDMA/UMTS)
MSM8930AB [47]Gobi 4G (LTE categoría 4)
APQ8016Snapdragon 41028 nm (TSMC 28LP) / 28 nm ( SMIC )4 núcleos hasta 1,2 GHz Cortex-A53Adreno 306 400/450 MHz (19,2/21,6 GFLOPS en FP32)Hexágono QDSP6 V5LPDDR2 / 3 Canal único de 32 bits a 533 MHz (4,2 GB/s)—Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou2.0Primer semestre de 2014
MSM8916 [48]X5 LTE (Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)
MSM8916 versión 2 [49]Snapdragon 41228 nm (TSMC 28LP)4 núcleos hasta 1,4 GHz Cortex-A53Adreno 306 450 MHz (21,6 GFLOPS en FP32)LPDDR2 / 3 Canal único de 32 bits a 600 MHz (4,8 GB/s)Segundo semestre de 2015
MSM8929 [50]Snapdragon 4154 + 4 núcleos (1,4 GHz + 1,0 GHz Cortex-A53 )Adreno 405 465 MHz (44,6 GFLOPS en FP32)Hexágono V50Cámara única de hasta 13 MPLPDDR3 de un solo canal, 32 bits, 667 MHz (5,3 GB/s)Bluetooth 4.1 + Bluetooth BLE, Wi-Fi MIMO multiusuario (MU-MIMO) 802.11ac (2,4/5,0 GHz), GPS IZat Gen8C LitePrimer semestre de 2015
MSM8917 [51]Snapdragon 4254 núcleos hasta 1,4 GHz Cortex-A53Adreno 308 598 MHz (28,7 GFLOPS en FP32)Hexágono 536Cámara única de hasta 16 MPX6 LTE (descarga: Cat 4, hasta 150 Mbit/s; carga: Cat 5, hasta 75 Mbit/s)Bluetooth v4.1, 802.11ac con MIMO multiusuario (MU-MIMO), IZat Gen8CTercer trimestre de 2016
MSM8920 [52]Snapdragon 427X9 LTE ​​(descarga: Cat 7, hasta 300 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)3.0Primer trimestre de 2017
MSM8937 [53]Snapdragon 4304 + 4 núcleos (1,4 GHz + 1,1 GHz Cortex-A53 )Adreno 505 450 MHz (43,2 GFLOPS en FP32)Cámara única de hasta 21 MPLPDDR3 de un solo canal, 32 bits, 800 MHz (6,4 GB/s)X6 LTESegundo trimestre de 2016
MSM8940 [54]Snapdragon 435X9 LTECuarto trimestre de 2016
SDM429 [55]Snapdragon 42912 nm (TSMC 12FFC)4 núcleos hasta 2,0 GHz Cortex-A53Adreno 504 320 MHz (30,7 GFLOPS en FP32)Hexágono 536Cámara única de hasta 16 MP / cámara dual de 8 MPX6 LTE (descarga: Cat 4, hasta 150 Mbit/s; carga: Cat 5, hasta 75 Mbit/s)Bluetooth 5, Wi-Fi 802.11ac hasta 433 Mbit/s, USB 2.0Tercer trimestre de 2018
SDM439 [56]Snapdragon 4394 + 4 núcleos (2,0 GHz + 1,45 GHz Cortex-A53 )Adreno 505 650 MHz (62,4 GFLOPS en FP32)Cámara única de hasta 21 MP / cámara dual de 8 MP
SDM450 [57]Snapdragon 45014 nm (Samsung 14LPP)8 núcleos hasta 1,8 GHz Cortex-A53Adreno 505 600 MHz (57,6 GFLOPS en FP32)Hexágono 546Cámara única de hasta 24 MP / cámara dual de 13 MPLPDDR3 de un solo canal, 32 bits, 933 MHz (7,5 GB/s)X9 LTE ​​(descarga: Cat 7, hasta 300 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 4.1, Wi-Fi 802.11ac hasta 433 Mbit/s, USB 3.0Tercer trimestre de 2017
SM4250-AA [58]Snapdragon 46011 nm (Samsung 11LPP)4 + 4 núcleos (1,8 GHz Kryo 240 Gold – Cortex-A73 + 1,6 GHz Kryo 240 Silver – Cortex-A53 )Adreno 610 600 MHz (153,6 GFLOPS en FP32)Hexágono 683Spectra 340 (cámara única de 48 MP / cámara dual de 16 MP)LPDDR3 hasta 933 MHz
o
LPDDR4X de doble canal de 16 bits (32 bits) 1866 MHz (14,9 GB/s)		X11 LTE (Cat 13: descarga hasta 390 Mbit/s, carga hasta 150 Mbit/s)FastConnect 6100, Bluetooth 5.1, NFC , Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, compatible con 802.11ax, NavIC , USB CPrimer trimestre de 2020
SM4350 [59]Snapdragon 4808 nm (Samsung 8LPP)2 + 6 núcleos ( Kryo 460 Gold de 2,0 GHz – Cortex-A76 + Kryo 460 Silver de 1,8 GHz – Cortex-A55 )Adreno  619 650 MHz (332,8 GFLOPS en FP32)Hexágono 686 (3,3 TOPS)Spectra 345 (cámara única de 64 MP / cámara dual de 25+13 MP con ZSL / cámara triple de 13 MP con ZSL)LPDDR4X Doble canal de 16 bits (32 bits), 2133 MHz (17,0 GB/s)X51 5G interno (5G NR Sub-6 y mmWave: descarga hasta 2,5 Gbit/s, carga hasta 660 Mbit/s; LTE: descarga Cat 15, hasta 800 Mbit/s, carga Cat 18, hasta 210 Mbit/s)FastConnect 6200, Bluetooth 5.1, NFC , compatible con 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO), USB C4+Primer semestre de 2021
SM4350-AC [60]Snapdragon 480+2 + 6 núcleos ( Kryo 460 Gold de 2,2 GHz – Cortex-A76 + Kryo 460 Silver de 1,9 GHz – Cortex-A55 )FastConnect 6200, Bluetooth 5.2, NFC , 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB CCuarto trimestre de 2021

Snapdragon 4 (2022-2024)

El Snapdragon 4 Gen 1 se anunció el 6 de septiembre de 2022. [61]
El Snapdragon 4 Gen 2 se anunció el 26 de junio de 2023. [62]
La versión líder del Snapdragon 4 Gen 2 se lanzó en Redmi Note 13R el 17 de mayo de 2024. [63]
El Snapdragon 4s Gen 2 se anunció el 30 de julio de 2024. [64]

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
SM4375 [65]Snapdragon 4 de 1.ª generación6 nm (TSMC N6)2 + 6 núcleos (2,0 GHz Kryo Gold – Cortex-A78 + 1,8 GHz Kryo Silver – Cortex-A55 )Adreno  619 700 MHz (358,4 GFLOPS en FP32)HexágonoSpectra (cámara única de 108 MP / cámara dual de 25+13 MP con ZSL / cámara triple de 13 MP con ZSL)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17,0 GB/s)X51 5G interno (5G NR Sub-6: descarga hasta 2,5 Gbit/s, carga hasta 900 Mbit/s; LTE: descarga Cat 15, hasta 800 Mbit/s, carga Cat 18, hasta 210 Mbit/s)FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.14+Tercer trimestre de 2022
SM4450 [66]Snapdragon 4 de segunda generación4 nm (Samsung 4LPX)2 + 6 núcleos (2,2 GHz Kryo Gold – Cortex-A78 + 1,95 GHz Kryo Silver – Cortex-A55 )Adreno  613 955 MHz (244,5 GFLOPS en FP32)—Spectra (cámara única de 108 MP / cámara dual de 16 MP con ZSL)LPDDR4X de doble canal de 16 bits (32 bits) a 2133 MHz (17,0 GB/s)
o
LPDDR5 de doble canal de 16 bits (32 bits) a 3200 MHz (25,6 GB/s)		X61 5G interno (5G NR Sub-6: descarga hasta 2,5 Gbit/s, carga hasta 900 Mbit/s)Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 de 1.ª generaciónSegundo trimestre de 2023
Snapdragon 4 Gen 2 Edición acelerada [a]4 nm (TSMC N4)2 + 6 núcleos (2,3 GHz Kryo Gold – Cortex-A78 + 1,95 GHz Kryo Silver – Cortex-A55 )Segundo trimestre de 2024
SM4635 [67]Snapdragon 4s de segunda generación4 nm (Samsung)2 + 6 núcleos (2,0 GHz Kryo Gold – Cortex-A78 + 1,8 GHz Kryo Silver – Cortex-A55 )Adreno  611Spectra (cámara única de 84 MP / cámara dual de 16 MP con ZSL)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17,0 GB/s)Interno (5G NR Sub-6: descarga hasta 1 Gbit/s)Tercer trimestre de 2024
  1. ^ También conocida como "Versión líder".

Serie Snapdragon 6

La serie Snapdragon 6 es el SoC de gama media orientado principalmente a los segmentos de gama básica y media, sucesor del S4 Plus. Es la línea Snapdragon más utilizada y aparece en dispositivos convencionales de varios fabricantes.

Serie Snapdragon 600 (2013-2023)

El Snapdragon 600 se anunció el 8 de enero de 2013. [68] A diferencia de los modelos posteriores de la serie 600, el Snapdragon 600 se consideró un SoC de gama alta similar al Snapdragon 800, y fue el sucesor directo tanto del Snapdragon S4 Plus como del S4 Pro.
El Snapdragon 610 y el Snapdragon 615 se anunciaron el 24 de febrero de 2014. [69] El Snapdragon 615 fue el primer SoC de ocho núcleos de Qualcomm. A partir del Snapdragon 610, la serie 600 es una línea de SoC de gama media, a diferencia del Snapdragon 600 original, que era un modelo de gama alta. [70]
El Snapdragon 616 fue anunciado el 31 de julio de 2015. [71]
El Snapdragon 617 fue anunciado el 15 de septiembre de 2015. [38]
El Snapdragon 625 fue anunciado el 11 de febrero de 2016. [72]
El Snapdragon 626 fue anunciado el 18 de octubre de 2016. [73] Snapdragon 625, 626, 632 y 450 son compatibles en PIN y software; software compatible con Snapdragon 425, 427, 429, 430, 435 y 439.
El Snapdragon 618 y el Snapdragon 620 fueron anunciados el 18 de febrero de 2015. [37] Desde entonces han sido renombrados como Snapdragon 650 y Snapdragon 652 respectivamente. [74]
El Snapdragon 653 fue anunciado el 18 de octubre de 2016. [40] [41]
El Snapdragon 630 y el Snapdragon 660 fueron anunciados el 8 de mayo de 2017. [75]
El Snapdragon 636 fue anunciado el 17 de octubre de 2017. [76] El Snapdragon 630, 636 y 660 son compatibles en PIN y software.
El Snapdragon 632 fue anunciado el 26 de junio de 2018. [43] Compatible en PIN y software con Snapdragon 625, 626 y 450; software compatible con Snapdragon 425, 427, 429, 430, 435 y 439.
El Snapdragon 670 fue anunciado el 8 de agosto de 2018. [77] Pin y software compatibles con Snapdragon 710.
El Snapdragon 675 fue anunciado el 22 de octubre de 2018. [78]
El Snapdragon 665 fue anunciado el 9 de abril de 2019. [79] [80]
El Snapdragon 662 fue anunciado el 20 de enero de 2020, con soporte NavIC . [44]
El Snapdragon 678 fue anunciado el 15 de diciembre de 2020. [81]
El Snapdragon 690 fue anunciado el 16 de junio de 2020, y es el primer SoC de gama media de Qualcomm que admite conectividad 5G. [82]
Los Snapdragon 680 y 695 se anunciaron el 26 de octubre de 2021. [46]
El Snapdragon 685 se anunció el 23 de marzo de 2023.

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
APQ8064-1AA (DEB/FLO) anunciado como S4 ProSnapdragon 60028 nm (TSMC 28LP)4 núcleos hasta 1,5 GHz Krait  300: 4+4 KB L0, 16+16 KB L1, 2 MB L2Adreno 320 400 MHz (76,8 GFLOPS en FP32)Hexágono QDSP6 V4 500 MHzCámara única de hasta 21 MP; captura de video: 1080p a 30 fpsDDR3L -1600 (12,8 GB/seg)ExternoBluetooth 4.0, 802.11a/b/g/n/ac (2,4/5 GHz), IZat Gen8A1.0Primer trimestre de 2013
APQ8064M [83]4 núcleos hasta 1,7 GHz Krait  300: 4+4 KB L0, 16+16 KB L1, 2 MB L2LPDDR3 de doble canal de 32 bits (64 bits) 533 MHz (8,6 GB/s)
APQ8064T [83]LPDDR3 de doble canal de 32 bits (64 bits) a 600 MHz (9,6 GB/s)
APQ8064AB [83]4 núcleos hasta 1,9 GHz Krait  300: 4+4 KB L0, 16+16 KB L1, 2 MB L2Adreno 320 450 MHz (86,4 GFLOPS en FP32)
MSM8936 [84]Snapdragon 6104 núcleos Cortex-A53 a 1,7 GHzAdreno 405 550 MHz (52,8 GFLOPS en FP32)Hexágono V50 700 MHzLPDDR3 de un solo canal, 32 bits, 800 MHz (6,4 GB/s)X5 LTE (Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou2.0Tercer trimestre de 2014
MSM8939 [85]Snapdragon 6154 + 4 núcleos (1,7 GHz + 1,1 GHz Cortex-A53 )
MSM8939 versión 2 [86]Snapdragon 6164 + 4 núcleos (1,7 GHz + 1,2 GHz Cortex-A53 )Tercer trimestre de 2015
MSM8952 [87]Snapdragon 6174 + 4 núcleos (1,5 GHz + 1,2 GHz Cortex-A53 )Hexágono 546LPDDR3 de un solo canal, 32 bits, 933 MHz (7,5 GB/s)X8 LTE (Cat 7: descarga hasta 300 Mbit/s, carga hasta 100 Mbit/s)Bluetooth 4.1, Wi-Fi 802.11n/ac de 1 flujo VIVE, IZat Gen8C; USB 2.03.0Cuarto trimestre de 2015
MSM8953 [88]Snapdragon 62514 nm (Samsung 14LPP)8 núcleos hasta 2,0 GHz Cortex-A53Adreno 506 650 MHz (62,4 GFLOPS en FP32)Cámara única de hasta 24 MP; captura de video: 4K a 30 fpsX9 LTE ​​(descarga: Cat 7, hasta 300 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 4.1, NFC, Wi-Fi MU-MIMO 802.11n/ac de 1 flujo VIVE, IZat Gen8C; USB 3.0Segundo trimestre de 2016
MSM8953 Pro [89]Snapdragon 6268 núcleos hasta 2,2 GHz Cortex-A53Cuarto trimestre de 2016
SDM630 [90]Snapdragon 6304 + 4 núcleos (2,2 GHz + 1,8 GHz Cortex-A53 ) [91] [92]Adreno  508 650 MHz (124,8 GFLOPS en FP32)Hexágono 642Spectra 160 (cámara única de 24 MP / cámara dual de 13 MP; captura de video: 4K a 30 fps)LPDDR4 de doble canal de 16 bits (32 bits) 1333 MHz (10,66 GB/s)X12 LTE (descarga: Cat 12, hasta 600 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 5, NFC , Wi-Fi 802.11ac hasta 433 Mbit/s, USB 3.14.0Segundo trimestre de 2017
SDM632 [93]Snapdragon 6324 + 4 núcleos (1,8 GHz Kryo 250 Gold – Cortex-A73 + 1,8 GHz Kryo 250 Silver – Cortex-A53 ) [94]Adreno  506 725 MHz (69,6 GFLOPS en FP32)Hexágono 546Cámara única de hasta 40 MP / cámara dual de 13 MP; captura de video: 4K a 30 fpsLPDDR3 de un solo canal, 32 bits, 933 MHz (7,5 GB/s)X9 LTE ​​(descarga: Cat 7, hasta 300 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)3.0Tercer trimestre de 2018
SDM636 [95]Snapdragon 6364 + 4 núcleos (1,8 GHz Kryo 260 Gold – Cortex-A73 + 1,6 GHz Kryo 260 Silver – Cortex-A53 )Adreno  509 430 MHz (110,1 GFLOPS en FP32)Hexágono 680Spectra 160 (cámara única de 24 MP/cámara dual de 16 MP; captura de video: 4K a 30 fps)LPDDR4 de doble canal de 16 bits (32 bits) 1333 MHz (10,7 GB/s)X12 LTE (descarga: Cat 12, hasta 600 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)4.0Cuarto trimestre de 2017
MSM8956 [96]Snapdragon 65028 nm (TSMC 28 HPM)2 + 4 núcleos (1,8 GHz Cortex-A72 + 1,4 GHz Cortex-A53 )Adreno 510 600 MHz (153,6 GFLOPS en FP32)Hexágono V56Cámara única de hasta 21 MP; captura de video: 4K a 30 fpsLPDDR3 de doble canal de 32 bits (64 bits) 933 MHz (14,9 GB/s)X8 LTE (Cat 7: descarga hasta 300 Mbit/s, carga hasta 100 Mbit/s)Bluetooth Smart 4.1, Wi-Fi 802.11ac de 1 flujo VIVE, GNSS IZat Gen8C; USB 2.03.0Primer trimestre de 2016
MSM8976 [97]Snapdragon 6524 + 4 núcleos (1,8 GHz Cortex-A72 + 1,4 GHz Cortex-A53 )
MSM8976 Pro [98]Snapdragon 6534 + 4 núcleos (1,95 GHz Cortex-A72 +
1,40 GHz Cortex-A53 )		Adreno 510 621 MHz (159 GFLOPS en FP32)X9 LTE ​​(descarga: Cat 7, hasta 300 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Cuarto trimestre de 2016
SDM660 [99]Snapdragon 66014 nm (Samsung 14LPP)4 + 4 núcleos (2,2 GHz Kryo 260 Gold – Cortex-A73 + 1,84 GHz Kryo 260 Silver – Cortex-A53 )Adreno  512 647 MHz (165,6 GFLOPS en FP32)Hexágono 680Spectra 160 (cámara única de 48 MP/cámara dual de 16 MP; captura de video: 4K a 30 fps)LPDDR4X Doble canal 16 bits (32 bits) 1866 MHz (14,9 GB/s)X12 LTE (descarga: Cat 12, hasta 600 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 5, NFC , Wi-Fi 802.11ac hasta 867 Mbit/s, USB 3.14.0Segundo trimestre de 2017
SDA660 [100]Interno: no
SM6115 [101]Snapdragon 66211 nm (Samsung 11LPP)4 + 4 núcleos ( Kryo 260 Gold de 2,0 GHz – Cortex-A73 + Kryo 260 Silver de 1,8 GHz – Cortex-A53 )Adreno  610 950 MHz (243,2 GFLOPS en FP32)Hexágono 683Spectra 340T (cámara única de 48 MP / cámara dual de 13 MP; captura de video: 1080p a 60 fps)LPDDR3 hasta 933 MHz / LPDDR4X Doble canal de 16 bits (32 bits) 1866 MHz (14,9 GB/s)X11 LTE (Cat 13: descarga hasta 390 Mbit/s, carga hasta 150 Mbit/s)FastConnect 6100, Bluetooth 5.1, NFC , Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, compatible con 802.11ax, NavIC , USB C3.0Primer trimestre de 2020
SM6125 [102]Snapdragon 665Hexágono 686 (3,3 TOPS)Spectra 165 (cámara única de 48 MP/cámara dual de 16 MP; captura de video: 4K a 30 fps)X12 LTE (descarga: Cat 12, hasta 600 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 5, NFC , Wi-Fi 802.11ac, USB 3.1Segundo trimestre de 2019
SDM670 [103]Snapdragon 67010 nm (Samsung 10LPP)2 + 6 núcleos ( Kryo 360 Gold de 2,0 GHz – Cortex-A75 + Kryo 360 Silver de 1,7 GHz – Cortex-A55 ) [104]Adreno  615 430 MHz (220,2 GFLOPS en FP32)Hexágono 685 (3 TOPS)Spectra 250 (cámara única de 192 MP/cámara dual de 16 MP con ZSL; captura de video: 4K a 30 fps)LPDDR4X Doble canal 16 bits (32 bits) 1866 MHz (14,9 GB/s)Bluetooth 5, NFC , Wi-Fi 802.11ac hasta 867 Mbit/s, USB 3.14+Tercer trimestre de 2018
SM6150 [105]Snapdragon 67511 nm (Samsung 11LPP)2 + 6 núcleos ( Kryo 460 Gold de 2,0 GHz – Cortex-A76 + Kryo 460 Silver de 1,7 GHz – Cortex-A55 ) [106]Adreno  612 845 MHz (216,3 GFLOPS en FP32)Spectra 250L (cámara única de 192 MP/cámara dual de 16 MP con ZSL; captura de video: 4K a 30 fps)Primer trimestre de 2019
SM6150-AC [107]Snapdragon 6782 + 6 núcleos ( Kryo 460 Gold de 2,2 GHz – Cortex-A76 + Kryo 460 Silver de 1,7 GHz – Cortex-A55 )Adreno  612 895 MHz (229,1 GFLOPS en FP32)Cuarto trimestre de 2020
SM6225 [108]Snapdragon 6806 nm (TSMC N6)4 + 4 núcleos (2,4 GHz Kryo 265 Gold – Cortex-A73 + 1,9 GHz Kryo 265 Silver – Cortex-A53 )Adreno  610 1114 MHz (285,2 GFLOPS en FP32)Hexágono 686 (3,3 TOPS)Spectra 346 (cámara única de 64 MP / cámara dual de 16 MP con ZSL / cámara triple de 13+13+5 MP con ZSL; captura de video: 1080p a 60 fps)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17 GB/s)X11 LTE (Cat 13: descarga hasta 390 Mbit/s, carga hasta 150 Mbit/s)FastConnect 6100, Bluetooth 5.1, NFC , Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, NavIC , USB C3.0Cuarto trimestre de 2021
SM6225-AD [109]Snapdragon 6854 + 4 núcleos (2,8 GHz Kryo 265 Gold – Cortex-A73 + 1,9 GHz Kryo 265 Silver – Cortex-A53 )Adreno  610 1260 MHz (322,6 GFLOPS en FP32)Spectra (cámara única de 108 MP / cámara dual de 16 MP con ZSL / cámara triple de 13+13+5 MP con ZSL; captura de video: 1080p a 60 fps)FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 1x1, USB 3.1Primer trimestre de 2023
SM6350 [110]Snapdragon 6908 nm (Samsung 8LPP)2 + 6 núcleos ( Kryo 560 Gold de 2,0 GHz – Cortex-A77 + Kryo 560 Silver de 1,7 GHz – Cortex-A55 )Adreno  619L 565 MHz (289,3 GFLOPS en FP32)Hexágono 692 (5 TOPS)Spectra 355L (cámara única de 192 MP/cámara dual de 32+16 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X Doble canal de 16 bits (32 bits), 1866 MHz (14,9 GB/s)X51 5G interno (5G NR Sub-6: descarga hasta 2,5 Gbit/s, carga hasta 900 Mbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6200, Bluetooth 5.1, NFC , compatible con 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO), USB 3.14+Segundo semestre de 2020
SM6375 [111]Snapdragon 6956 nm (TSMC N6)2 + 6 núcleos ( Kryo 660 Gold de 2,2 GHz – Cortex-A78 + Kryo 660 Silver de 1,8 GHz – Cortex-A55 )Adreno  619 840 MHz (430,1 GFLOPS en FP32)Hexágono 686 (3,3 TOPS)Spectra 346T (cámara única de 108 MP / cámara dual de 25+13 MP con ZSL / cámara triple de 13 MP con ZSL; captura de video: 1080p a 60 fps)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17 GB/s)X51 5G interno (5G NR Sub-6 y mmWave: descarga hasta 2,5 Gbit/s, carga hasta 1,5 Gbit/s; LTE: descarga Cat 15, hasta 800 Mbit/s, carga Cat 18, hasta 210 Mbit/s)FastConnect 6200, Bluetooth 5.2, NFC , 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB CCuarto trimestre de 2021

Snapdragon 6 (2022-2024)

El Snapdragon 6 Gen 1 se anunció el 6 de septiembre de 2022. [61]
El Snapdragon 6s Gen 3 se anunció el 6 de junio de 2024.
El Snapdragon 6s Gen 1 se lanzó en Oppo A3x el 9 de agosto de 2024. [112]
El Snapdragon 6 Gen 3 se anunció el 31 de agosto de 2024.

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
SM6450 [113]Snapdragon 6 de 1.ª generación4 nm (Samsung 4LPX)4 + 4 núcleos (2,2 GHz Kryo Gold – Cortex-A78 + 1,8 GHz Kryo Silver – Cortex-A55 )Adreno  710 676 MHz (346,1 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 48 MP con ZSL / cámara dual de 25+16 MP con ZSL / cámara triple de 13 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR5 de doble canal, 16 bits (32 bits), 2750 MHz (22 GB/s)Interno: X62 5G (5G NR Sub-6 y mmWave: descarga hasta 2,9 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.14+Primer trimestre de 2023
SM6115-AC [114]Snapdragon 6s de 1.ª generación11 nm (Samsung 11LPP)4 + 4 núcleos (2,1 GHz Kryo Gold – Cortex-A73 + 2,0 GHz Kryo Silver – Cortex-A53 )Adreno  610 1050 MHz (268,8 GFLOPS en FP32)HexágonoSpectra (cámara única de 48 MP / cámara dual de 13 MP con ZSL; captura de video: 1080p a 60 fps)LPDDR3 hasta 933 MHz / LPDDR4X Doble canal de 16 bits (32 bits) 2133 MHz (17 GB/s)X11 LTE (Cat 13: descarga hasta 390 Mbit/s, carga hasta 150 Mbit/s)FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, compatible con 802.11ax, USB C3.0Tercer trimestre de 2024
SM6475-AB [115]Snapdragon 6 de 3.ª generación4 nm (Samsung 4LPX)4 + 4 núcleos (2,4 GHz Kryo Gold – Cortex-A78 + 1,8 GHz Kryo Silver – Cortex-A55 )Adreno  710HexágonoSpectra (captura de fotos de 200 MP / cámara única de 48 MP con ZSL / cámara dual de 32+16 MP con ZSL / cámara triple de 16 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X de doble canal de 16 bits (32 bits) a 2133 MHz (17,0 GB/s)
o
LPDDR5 de doble canal de 16 bits (32 bits) a 3200 MHz (25,6 GB/s)		Interno: X62 5G (5G NR Sub-6 y mmWave: descarga hasta 2,9 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.14+Tercer trimestre de 2024
SM6375-AC [116]Snapdragon 6s de 3.ª generación6 nm (TSMC N6)2 + 6 núcleos (2,3 GHz Kryo Gold – Cortex-A78 + 2,0 GHz Kryo Silver – Cortex-A55 )Adreno  619 900 MHz (460,8 GFLOPS en FP32)HexágonoSpectra (cámara única de 108 MP / cámara dual de 25+13 MP con ZSL / cámara triple de 13 MP con ZSL; captura de video: 1080p a 60 fps)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17 GB/s)X51 5G interno (5G NR Sub-6 y mmWave: descarga hasta 2,5 Gbit/s, carga hasta 1,5 Gbit/s; LTE: descarga Cat 15, hasta 800 Mbit/s, carga Cat 18, hasta 210 Mbit/s)FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB CSegundo trimestre de 2024

Serie Snapdragon 7

El 27 de febrero de 2018, Qualcomm presentó la serie de plataformas móviles Snapdragon 7. Es un SoC de gama media superior diseñado para cerrar la brecha entre la serie 6 y la serie 8, y principalmente dirigido al segmento de gama media premium. [117]

Serie Snapdragon 700 (2018-2022)

El Snapdragon 710 se anunció el 23 de mayo de 2018. [118] Es compatible en pines y software con el Snapdragon 670.
El Snapdragon 712 se anunció el 6 de febrero de 2019. [119]
El Snapdragon 730 y 730G se anunciaron el 9 de abril de 2019. [79] [120]
El Snapdragon 720G se anunció el 20 de enero de 2020. [44]
El Snapdragon 732G se anunció el 31 de agosto de 2020. [121]
El Snapdragon 765 y 765G se anunciaron el 4 de diciembre de 2019 [122] como los primeros SoC de Qualcomm con un módem 5G integrado y los primeros SoC de la serie 700 que admiten controladores de GPU actualizables a través de Play Store . [123]
El Snapdragon 768G se anunció el 10 de mayo de 2020. [124]
El Snapdragon 750G se anunció el 22 de septiembre de 2020. [125]
El Snapdragon 780G se anunció el 25 de marzo de 2021. [126]
El Snapdragon 778G se anunció el 19 de mayo de 2021. [127]
El Snapdragon 778G+ se anunció el 26 de octubre de 2021. [46]
El Snapdragon 782G se anunció el 23 de noviembre de 2022. [128]

Número de modeloNombre del productofabulosoProcesador ( ARMv8.2 )GPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
SDM710 [129]Snapdragon 71010 nm (Samsung 10LPP)2 + 6 núcleos ( Kryo 360 Gold de 2,2 GHz – Cortex-A75 + Kryo 360 Silver de 1,7 GHz – Cortex-A55 )Adreno  616 504 MHz (258 GFLOPS en FP32)Hexágono 685 (3 TOPS)Spectra 250 (cámara única de 192 MP/cámara dual de 16 MP con ZSL; captura de video: 4K a 30 fps)LPDDR4X Doble canal de 16 bits (32 bits), 1866 MHz (14,9 GB/s)X15 LTE (descarga: Cat 15, hasta 800 Mbit/s; carga: Cat 13, hasta 150 Mbit/s)Bluetooth 5.0; NFC ; 802.11a/b/g/n/ac 2x2 (MU-MIMO); Wi-Fi hasta 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.14Segundo trimestre de 2018
SDM712 [130]Snapdragon 7122 + 6 núcleos ( Kryo 360 Gold de 2,3 GHz – Cortex-A75 + Kryo 360 Silver de 1,7 GHz – Cortex-A55 )Adreno  616 610 MHz (312,3 GFLOPS en FP32)4+Primer trimestre de 2019
SM7125 [131]Snapdragon 720G8 nm (Samsung 8LPP)2 + 6 núcleos (2,3 GHz Kryo 465 Gold – Cortex-A76 + 1,8 GHz Kryo 465 Silver – Cortex-A55 )Adreno  618 750 MHz (384 GFLOPS en FP32)Hexágono 692 (5 TOPS)Spectra 350L (cámara única de 192 MP/cámara dual de 16 MP con ZSL; captura de video: 4K a 30 fps)FastConnect 6200; Bluetooth 5.1; NFC ; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO); Wi-Fi hasta 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC ; USB 3.1Primer trimestre de 2020
SM7150-AA, [132]Snapdragon 7302 + 6 núcleos ( Kryo 470 Gold de 2,2 GHz – Cortex-A76 + Kryo 470 Silver de 1,8 GHz – Cortex-A55 )Adreno  618 610 MHz (312,3 GFLOPS en FP32)Hexágono 688 (3,6 TOP)Spectra 350 (cámara única de 192 MP/cámara dual de 22 MP con ZSL; captura de video: 4K a 30 fps HDR)FastConnect 6200; Bluetooth 5.0; NFC ; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO); Wi-Fi hasta 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1Segundo trimestre de 2019
SM7150-AB [133]Snapdragon 730GAdreno  618 700 MHz (358,4 GFLOPS en FP32)
SM7150-AC [134]Snapdragon 732G2 + 6 núcleos ( Kryo 470 Gold de 2,3 GHz – Cortex-A76 + Kryo 470 Silver de 1,8 GHz – Cortex-A55 )Adreno  618 800 MHz (409,6 GFLOPS en FP32)FastConnect 6200; Bluetooth 5.1; NFC ; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO); Wi-Fi hasta 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1Tercer trimestre de 2020
SM7225 [135]Snapdragon 750G2 + 6 núcleos ( Kryo 570 Gold de 2,2 GHz – Cortex-A77 + Kryo 570 Silver de 1,8 GHz – Cortex-A55 )Adreno  619 800 MHz (409,6 GFLOPS en FP32)Hexágono 694 (4,7 TOP)Spectra 355L (cámara única de 192 MP/cámara dual de 32+16 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X Doble canal de 16 bits (32 bits), 2133 MHz (17 GB/s)X52 5G interno (5G NR Sub-6 y mmWave: descarga hasta 3,7 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6200; Bluetooth 5.1; NFC ; compatible con 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO); GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1Cuarto trimestre de 2020
SM7250-AA, [136]Snapdragon 7657 nm (Samsung 7LPP)1 x 2,3 GHz {765} Kryo 475 Prime ( Cortex-A76 ) +
1 x 2,2 GHz Kryo 475 Gold ( Cortex-A76 ) +
6 x 1,8 GHz Kryo 475 Silver ( Cortex-A55 )		Adreno  620 540 MHz (414,7 GFLOPS en FP32)Hexágono 696 (5,4 TOP)Spectra 355 (captura de fotos de 192 MP / cámara única de 36 MP con ZSL / cámara dual de 22 MP con ZSL; captura de video: 4K a 30 fps HDR)FastConnect 6200; Bluetooth 5.0; NFC ; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) hasta 867 Mbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1Primer trimestre de 2020
SM7250-AB [137]Snapdragon 765G1 x 2,4 GHz Kryo 475 Prime ( Cortex-A76 ) +
1 x 2,2 GHz Kryo 475 Gold ( Cortex-A76 ) +
6 x 1,8 GHz Kryo 475 Silver ( Cortex-A55 )		Adreno  620 625 MHz (480 GFLOPS en FP32)
SM7250-AC [138]Snapdragon 768G1 x 2,8 GHz Kryo 475 Prime ( Cortex-A76 ) +
1 x 2,4 GHz Kryo 475 Gold ( Cortex-A76 ) +
6 x 1,8 GHz Kryo 475 Silver ( Cortex-A55 )		Adreno  620 750 MHz (576 GFLOPS en FP32)FastConnect 6200; Bluetooth 5.2; NFC ; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) hasta 867 Mbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1Segundo trimestre de 2020
SM7325 [139]Snapdragon 778G6 nm (TSMC N6)1 x 2,4 GHz Kryo 670 Prime ( Cortex-A78 ) +
3 x 2,4 GHz Kryo 670 Gold ( Cortex-A78 ) +
4 x 1,8 GHz Kryo 670 Silver ( Cortex-A55 )		Adreno  642L 550 MHz (563,2 GFLOPS en FP32)Hexágono 770 (12 TOP)Spectra 570L (captura de fotos de 200 MP / cámara única de 64 MP con ZSL / cámara dual de 36+22 MP con ZSL / cámara triple de 22 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR5 de doble canal, 16 bits (32 bits), 3200 MHz (25,6 GB/s)Interno: X53 5G (5G NR Sub-6 y mmWave: descarga hasta 3,7 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1Segundo trimestre de 2021
SM7325-AE [140]Snapdragon 778G+1 x 2,5 GHz Kryo 670 Prime ( Cortex-A78 ) +
3 x 2,4 GHz Kryo 670 Gold ( Cortex-A78 ) +
4 x 1,8 GHz Kryo 670 Silver ( Cortex-A55 )		Adreno  642L 608 MHz (622,6 GFLOPS en FP32)Cuarto trimestre de 2021
SM7350-AB [141]Snapdragon 780G5 nm (Samsung 5LPE)1 x 2,4 GHz Kryo 670 Prime ( Cortex-A78 ) +
3 x 2,2 GHz Kryo 670 Gold ( Cortex-A78 ) +
4 x 1,9 GHz Kryo 670 Silver ( Cortex-A55 )		Adreno  642 490 MHz (752,6 GFLOPS en FP32)Spectra 570 (captura de fotos de 192 MP / cámara única de 84 MP con ZSL / cámara dual de 64+20 MP con ZSL / cámara triple de 25 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X Doble canal 16 bits (32 bits) 2133 MHz (17 GB/s)Interno: X53 5G (5G NR Sub-6: descarga hasta 3,3 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 3,6 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1Primer trimestre de 2021
SM7325-AF [142]Snapdragon 782G6 nm (TSMC N6)1 x 2,7 GHz Kryo 670 Prime ( Cortex-A78 ) +
3 x 2,4 GHz Kryo 670 Gold ( Cortex-A78 ) +
4 x 1,8 GHz Kryo 670 Silver ( Cortex-A55 )		Adreno  642L 719 MHz (736,3 GFLOPS en FP32)Spectra 570L (captura de fotos de 200 MP / cámara única de 64 MP con ZSL / cámara dual de 36+22 MP con ZSL / cámara triple de 22 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR5 de doble canal, 16 bits (32 bits), 3200 MHz (25,6 GB/s)Interno: X53 5G (5G NR Sub-6 y mmWave: descarga hasta 3,7 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1Cuarto trimestre de 2022

Snapdragon 7 (2022-2024)

El Snapdragon 7 Gen 1 se anunció el 20 de mayo de 2022. [143]
El Snapdragon 7+ Gen 2 se anunció el 17 de marzo de 2023. [144]
El Snapdragon 7s Gen 2 se anunció el 15 de septiembre de 2023.
El Snapdragon 7 Gen 3 se anunció el 17 de noviembre de 2023. [145]
El Snapdragon 7+ Gen 3 se anunció el 21 de marzo de 2024. [146]
El Snapdragon 7s Gen 3 se anunció el 20 de agosto de 2024. [147]

Número de modeloNombre del productofabulosoUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
SM7450-AB [148]Snapdragon 7 de 1.ª generación4 nm (Samsung 4LPX)1 x 2,4 GHz {Edición acelerada de 2,5 GHz} Kryo Prime ( Cortex-A710 ) +
3 x 2,36 GHz Kryo Gold ( Cortex-A710 ) +
4 x 1,8 GHz Kryo Silver ( Cortex-A510 )		Adreno  644 443 MHz (680,4 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 84 MP con ZSL / cámara dual de 64+20 MP con ZSL / cámara triple de 25 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR5 de doble canal, 16 bits (32 bits), 3200 MHz (25,6 GB/s)Interno: X62 5G (5G NR Sub-6 y mmWave: descarga hasta 4,4 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.14+Segundo trimestre de 2022
SM7475-AB [149]Snapdragon 7+ de segunda generación4 nm (TSMC N4)1 x 2,91 GHz Kryo Prime ( Cortex-X2 ) +
3 x 2,49 GHz Kryo Gold ( Cortex-A710 ) +
4 x 1,8 GHz Kryo Silver ( Cortex-A510 )		Adreno  725 580 MHz (1187,8 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 108 MP con ZSL / cámara dual de 64+36 MP con ZSL / cámara triple de 32 MP con ZSL; captura de video: 4K a 60 fps HDR)FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 3,6 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.15Primer trimestre de 2023
SM7435-AB [150]Snapdragon 7s de segunda generación4 nm (Samsung 4LPX)4 + 4 núcleos (2,4 GHz Kryo Gold – Cortex-A78 + 1,95 GHz Kryo Silver – Cortex-A55 )Adreno  710 940 MHz (481,3 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 48 MP con ZSL / cámara dual de 32+16 MP con ZSL / cámara triple de 16 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X de doble canal de 16 bits (32 bits) a 2133 MHz (17,0 GB/s)
o
LPDDR5 de doble canal de 16 bits (32 bits) a 3200 MHz (25,6 GB/s)		Interno: X62 5G (5G NR Sub-6 y mmWave: descarga hasta 2,9 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.14+Tercer trimestre de 2023
SM7550-AB [151]Snapdragon 7 de 3.ª generación4 nm (TSMC N4P)1 x 2,63 GHz Kryo Prime ( Cortex-A715 ) +
3 x 2,4 GHz Kryo Gold ( Cortex-A715 ) +
4 x 1,8 GHz Kryo Silver ( Cortex-A510 )		Adreno  720 975 MHz (998,4 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 64 MP con ZSL / cámara dual de 32+21 MP con ZSL / cámara triple de 21 MP con ZSL; captura de video: 4K a 60 fps HDR)Interno: X63 5G (5G NR Sub-6 y mmWave: descarga hasta 5 Gbit/s, carga hasta 3,5 Gbit/s)FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.15Cuarto trimestre de 2023
SM7675-AB [152]Snapdragon 7+ de 3.ª generación1 procesador Kryo Prime de 2,8 GHz ( Cortex-X4 ) +
4 procesadores Kryo Gold de 2,6 GHz ( Cortex-A720 ) +
3 procesadores Kryo Silver de 1,9 GHz ( Cortex-A520 )		Adreno  732 950 MHz (1459,2 GFLOPS en FP32)HexágonoSpectra (captura de fotos de 200 MP / cámara única de 108 MP con ZSL / cámara dual de 64+36 MP con ZSL / cámara triple de 36 MP con ZSL; captura de video: 4K a 60 fps HDR)LPDDR5X de cuatro canales, 16 bits (64 bits), 4200 MHz (67,2 GB/s)FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) hasta 5,8 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1Primer trimestre de 2024
SM7635 [153]Snapdragon 7s de 3.ª generación1 procesador Kryo Prime de 2,5 GHz ( Cortex-A720 ) +
3 procesadores Kryo Gold de 2,4 GHz ( Cortex-A720 ) +
4 procesadores Kryo Silver de 1,8 GHz ( Cortex-A520 )		Adreno 810HexágonoSpectra (captura de fotos de 200 MP / cámara única de 64 MP con ZSL / cámara dual de 32+21 MP con ZSL / cámara triple de 21 MP con ZSL; captura de video: 4K a 30 fps HDR)LPDDR4X de doble canal de 16 bits (32 bits) a 2133 MHz (17,0 GB/s)
o
LPDDR5 de doble canal de 16 bits (32 bits) a 3200 MHz (25,6 GB/s)		Interno: X62 5G (5G NR Sub-6 y mmWave: descarga hasta 2,9 Gbit/s, carga hasta 1,6 Gbit/s; LTE Cat 18: descarga hasta 1,2 Gbit/s, carga hasta 210 Mbit/s)FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) hasta 2,9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.14+Tercer trimestre de 2024

Serie Snapdragon 8

La serie Snapdragon 8 es el SoC de gama alta y sirve como el buque insignia actual de Qualcomm, sucediendo al S4 Pro y a las antiguas series S1/S2/S3.

Serie Snapdragon 800 (2013-2021)

Características de la serie Snapdragon 800
El Snapdragon 800 se anunció el 8 de enero de 2013. [68]

El Snapdragon 801 se anunció el 24 de febrero de 2014. [156] [157]

El Snapdragon 805 se anunció el 20 de noviembre de 2013. [159]

  • Características de la CPU
    • 4 núcleos hasta 2,7 GHz Krait  450
    • Interfaz de memoria LPDDR3 de hasta 128 bits de ancho
  • Características de la GPU
    • GPU Adreno 420
      • Hasta 128 ALU
      • Soporte de teselación dinámica de hardware
      • Soporte para sombreadores de casco, dominio y geometría [160]
      • Actualización con nueva conexión dedicada al controlador de memoria (desde el bus compartido con el decodificador de video y el ISP) [160]
      • Hasta un 40% de aumento en el rendimiento del hardware de sombreado [160]
      • Caché L2 1,5 veces más grande (1536 KB en lugar de 1024 KB)
      • Mejor soporte de filtrado anisotrópico
      • Caché de textura más grande [161]
      • Soporte completo para Direct3D Feature Level 11_2 y OpenCL 1.2
  • Características del DSP
    • Mejora de la compatibilidad con H.265 : decodificación de hardware UHD/30 fps [162]
    • Codificación y decodificación 1080p 120 fps
  • Características del ISP
    • Hasta 55 megapíxeles
    • Rendimiento: 1,0 GP/seg (de 0,64 GP/seg en SD800) [163]
  • Funciones de módem e inalámbricas
    • Módem externo

Los Snapdragon 808 y 810 se anunciaron el 7 de abril de 2014. [164] Características notables
del Snapdragon 808 en comparación con su predecesor (805): [165]

Características destacables del Snapdragon 810 respecto a su versión de gama baja (808): [169]

El Snapdragon 820 se anunció en el Congreso Mundial de Móviles en marzo de 2015, [171] y los primeros teléfonos con el SoC se lanzaron a principios de 2016. [172] [173]
Características notables sobre sus predecesores (808 y 810): [171]

  • Características de la CPU
    • CPU de cuatro núcleos Kryo personalizada
    • Por núcleo: L1: 32+32 KB, L2: 2 MB + 1 MB [172]
    • Caché L3 compartida entre clústeres de CPU [174]
  • Características de la GPU
  • Características del DSP
    • Motor de IA de primera generación Hexagon 680 DSP [175]
      • Consumo de energía reducido a 2-3 veces (desde SD808)
      • Nueva isla de bajo consumo (LPI) para aplicaciones con sensores
      • Extensiones de vectores hexagonales
    • Isla de bajo consumo de All-Ways Aware Hub
    • Motor de procesamiento neuronal ( NPE )
    • Compatibilidad con Halide y TensorFlow
    • Codificación H.264, H.265 UHD/30 fps
    • Decodificación H.264 , H.265 de 10 bits, VP9 UHD/60 fps
  • Características del ISP
    • ISP Qualcomm Spectra con dos ISP de 14 bits
    • Cámara única de 28 MP a 30 fps; cámara única de 25 MP a 30 fps con ZSL; cámara dual de 13 MP con ZSL
    • Captura de video: captura de video HEVC Ultra HD de hasta 4K a 30 FPS
    • Reproducción de video: Reproducción de video HEVC de hasta 4K Ultra HD de 10 bits a 60 FPS, 1080p a 240 FPS
    • Rendimiento: 1,2 GP/seg (igual que 810)
  • Funciones de módem e inalámbricas
  • Características del SOC

El Snapdragon 821 se anunció en julio de 2016. [178] El 821 proporciona una mejora del 10% en el rendimiento sobre el 820 debido a una CPU con una velocidad de reloj más rápida, pero por lo demás tiene características similares, y Qualcomm afirma que el 821 está diseñado para complementar en lugar de reemplazar al 820. [178]
Características notables sobre su predecesor (820):

  • Características de la CPU
    • CPU más rápida (+10%)
  • Características de la GPU
    • GPU más rápida 650 MHz desde 624 (+5%)
    • SDK de realidad virtual de Snapdragon. [179]
  • Características del ISP
    • Admite PD dual (PDAF). [179]
    • Enfoque automático láser extendido. [179]

El Snapdragon 835 se anunció el 17 de noviembre de 2016. [180]
Características notables sobre su predecesor (821):

El Snapdragon 845 fue anunciado el 7 de diciembre de 2017. [185] [186]
Características notables sobre su predecesor (835): [187] [188] [189]

El Snapdragon 855 se anunció el 5 de diciembre de 2018. [195] [196] El Snapdragon 855 es el primer chipset FinFET de 7 nm de Qualcomm .
Características destacadas con respecto a su predecesor (845):

  • Proceso de 7 nm ( TSMC N7)
  • Tamaño de la matriz: 73 mm² (8,48 mm × 8,64 mm) [197] [198]
  • 6.7 mil millones de transistores [198]
  • Admite hasta 16 GB de soporte LPDDR4X 2133 MHz
  • Bus de memoria de 4x16 bits (34,13 GB/s) hasta 16 GB [199]
  • NVM Express 2x 3.0 (1x para módem 5G externo)
  • Características de la CPU [200]
  • 3 MB de caché a nivel de sistema
  • Características de la GPU
    • GPU Adreno 640 compatible con Vulkan 1.1
    • Hasta 768 ALU (desde 512 en Adreno 630)
    • GPU de tres núcleos a 585 MHz con 768 ALU, 36 TMU y 28 ROP (en comparación con 512 ALU, 24 TMU y 16 ROP) [181]
    • 954,7 GFLOP FP32, 1853,3 GFLOP FP16, 28,1 GTexels/s bilineales, 9,4 GPixels/s y 300 GB/s de ancho de banda de memoria efectiva [201]
    • Juegos HDR (profundidad de color de 10 bits, Rec. 2020)
    • Juegos a 120 fps
    • Mejora del decodificador H.265 y VP9 acelerado por hardware
    • Compatibilidad con códecs de reproducción HDR para HDR10+ , HDR10 , HLG y Dolby Vision
    • Reproducción de vídeo de realidad virtual volumétrica
    • Reproducción de video 8K 360 VR
    • Actualizaciones trimestrales de controladores de GPU a través de Google Play Store
    • Herramienta de inspección de GPU de Android [202]
  • Características del DSP [203]
    • Motor de inteligencia artificial de cuarta generación Hexagon 690 con más de 7 billones de operaciones por segundo (TOPS)
    • Acelerador vectorial Hexagon de Qualcomm con extensiones vectoriales Hexagon
    • Acelerador tensor hexagonal de Qualcomm (HTA)
    • Asistente de voz Qualcomm Hexagon
    • Centro de conocimiento en todos los sentidos
    • Compatibilidad con Caffe , Caffe2 , Halide y TensorFlow
    • Rendimiento vectorial/escalar comparado con Hexagon 680: se duplicaron las unidades vectoriales HVX y se incrementó un 20 % el rendimiento escalar
  • Características del ISP:
    • Qualcomm Spectra 380 con dos CV-ISP de 14 bits y acelerador de hardware para visión artificial
    • Reducción de ruido de múltiples cuadros [204]
    • AF híbrido
    • Cámara única de 192 MP; cámara única de 48 MP a 30 fps con MFNR/ZSL; cámara dual de 22 MP a 30 fps con MFNR/ZSL
    • Soporte para captura de fotografías HEIF
    • Funciones CV de hardware de tres núcleos que incluyen detección y seguimiento de objetos y procesamiento de profundidad estéreo
    • Solución HDR avanzada que incluye zzHDR mejorado y matriz de filtros de color cuádruple (QCFA) HDR de 3 exposiciones
    • El video HDR 4K a 60 FPS con segmentación de objetos en tiempo real (modo retrato, intercambio de fondo) incluye HDR10, HDR10+ y HLG con modo retrato (bokeh), profundidad de color de 10 bits y gama de colores Rec. 2020
    • Hasta 1,32 Gpixel/s [205]
    • Formatos de captura de vídeo: HDR10, HLG
    • Compatibilidad con códecs de vídeo: H.265 ( HEVC ), H.264 ( AVC ), HLG, HDR10 , HDR10+, VP8 , VP9
  • Funciones de módem e inalámbricas: [206]
    • Módem LTE X24 interno
    • Descargar: 2000 Mbit/s DL (Cat. 20), CA 7x20 MHz, 256-QAM, MIMO 4x4
    • Carga: 316 Mbit/s UL (Cat 20), 3x20 MHz CA, 256-QAM
    • Snapdragon X50 externo (módem 5G) : 5000 Mbit/s DL
    • Plataforma móvil compatible con Qualcomm Wi-Fi 6 :
      • Estándares Wi-Fi : compatible con 802.11ax, 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Bandas espectrales de Wi-Fi: 2,4 GHz, 5 GHz • Utilización del canal: 20/40/80 MHz
      • Configuración MIMO : 2x2 (2 flujos) • MU-MIMO • Doble banda simultánea (DBS)
      • Características principales: Sonido 8x8 (hasta 2 veces más que los dispositivos con sonido 4x4), tiempo de activación objetivo para una eficiencia energética hasta un 67 % mejor, seguridad más reciente con WPA3
    • Plataforma móvil Qualcomm Wi-Fi de 60 GHz
      • Estándares Wi-Fi : 802.11ad, 802.11ay
      • Banda espectral de Wi-Fi: 60 GHz
      • Velocidad máxima: 10 Gbit/s

El Snapdragon 855+ se anunció el 15 de julio de 2019. [207] Es una versión overclockeada del Snapdragon 855 que proporciona un rendimiento de CPU y GPU un 10% superior.

El Snapdragon 860 se anunció el 22 de marzo de 2021. Es un cambio de marca puro del Snapdragon 855+.

El Snapdragon 865 se anunció el 4 de diciembre de 2019. [208]
Características notables sobre su predecesor (855): [209]

  • Proceso de 7 nm de segunda generación (N7P TSMC) [210]
  • 10.3 mil millones de transistores [211]
  • 83,54 mm2 (8,49 mm x 9,84 mm) [212]
  • Admite hasta 16 GB de compatibilidad con LPDDR5 2750 MHz o LPDDR4X 2133 MHz
  • Bus de memoria de 4x16 bits (o 34,13 GB/s) hasta 16 GB [213]
  • NVM Express 2x 3.0 (1x para módem 5G externo)
  • Admite carga rápida 4+
  • Características de la CPU
  • 3 MB de caché a nivel de sistema
  • Características de la GPU [213]
    • GPU Adreno 650 compatible con Vulkan 1.1
    • Representación gráfica un 25 % más rápida y un 35 % más de eficiencia energética
    • Actualizaciones trimestrales de controladores de GPU a través de Google Play Store
    • Herramienta de inspección de GPU de Android [202]
    • Representación avanzada del escritorio
    • Hasta 1029,1 GFLOP en FP32 (desde 898,5 GFLOP en SD855)
  • Características del DSP
  • Características del ISP:
    • Qualcomm Spectra 480 con dos CV-ISP de 14 bits y acelerador de hardware para visión artificial
    • Reducción de ruido de múltiples cuadros [204]
    • AF híbrido
    • Cámara única de 200 MP; cámara única de 64 MP a 30 fps con MFNR/ZSL; cámara dual de 25 MP a 30 fps con MFNR/ZSL
    • Vídeo HDR 8K 30 FPS y 4K 120 FPS
    • Hasta 2 Gpixel/s
    • Formatos de captura de vídeo: Dolby Vision , HDR10 , HDR10+, HEVC
    • Compatibilidad con códecs de vídeo: Dolby Vision, H.265 ( HEVC ), HDR10+, HLG, HDR10, H.264 (AVC) , VP8 , VP9
    • Nuevas funcionalidades para mejorar la reducción de ruido y las mejoras de contraste local
  • Funciones del módem e inalámbricas:
    • Módem externo X55 5G
    • Modos: NSA, SA, TDD, FDD
    • 5G mmWave: ancho de banda de 800 MHz, 8 portadoras, MIMO 2×2
    • 5G sub-6 GHz: ancho de banda de 200 MHz, MIMO 4×4
    • Descarga 5G NR Sub-6 + mmWave: 7000 Mbit/s DL
    • 5G NR Sub-6 + mmWave subida: 3000 Mbit/s UL
    • Descarga LTE : 2500 Mbit/s DL (Cat. 24), CA 7x20 MHz, 1024-QAM, MIMO 4x4
    • Carga LTE : 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Uso compartido dinámico del espectro (DSS)
    • Plataforma móvil compatible con Qualcomm Wi-Fi 6 :
      • Qualcomm FastConnect 6800 (para 865 y 870), 6900 (para 865+)
      • Estándares Wi-Fi : compatible con 802.11ax ( Wi-Fi 6E para 865+), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Bandas espectrales de Wi-Fi: 2,4 GHz, 5 GHz (para 865 y 870), 2,4 GHz, 5 GHz, 6 GHz (para 865+) • utilización del canal: 20/40/80 MHz (para 865 y 870), 20/40/80/160 MHz (para 865+)
      • Configuración MIMO : 2x2 (2 flujos espaciales) • MU-MIMO • Doble banda simultánea (DBS)
      • Características principales: Sonido 8x8 (hasta 2 veces más que los dispositivos con sonido 4x4), Tiempo de activación objetivo para una eficiencia energética hasta un 67 % mejor, seguridad más reciente con WPA3
    • Plataforma móvil Qualcomm Wi-Fi de 60 GHz
      • Estándares Wi-Fi : 802.11ad, 802.11ay
      • Banda espectral de Wi-Fi: 60 GHz
      • Velocidad máxima: 10 Gbit/s
  • Otras características:
    • Unidad de procesamiento seguro (SPU) con soporte integrado para doble SIM y doble modo de espera

El Snapdragon 865+ se anunció el 8 de julio de 2020. [214]

El Snapdragon 870 se anunció el 19 de enero de 2021. [215] La única diferencia entre este y el Snapdragon 865+ es un pequeño aumento de 0,1 GHz en la frecuencia de reloj en el núcleo principal.

El Snapdragon 888 se anunció el 1 de diciembre de 2020. [216] [217] [218] [219] [220]
Características notables sobre su predecesor (865):

  • Proceso de 5 nm ( Samsung 5LPE)
  • ~10 mil millones de transistores
  • Admite hasta 16 GB LPDDR5 3200 MHz (51,2 GB/s) [221]
  • Bus de memoria de 4x16 bits
  • Carga rápida 5 (100 W+)
  • Admite UFS 3.1
  • Características de la CPU
  • 3 MB de caché a nivel de sistema
  • Características de la GPU
    • GPU Adreno 660 con compatibilidad con API: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
    • Hasta 840 MHz (desde 670 MHz en 865+ y 870)
    • Representación gráfica un 35 % más rápida y un 20 % más de eficiencia energética
    • Aumento del rendimiento de la IA del 73 % (de 15 TOPS a 26 TOPS)
    • Sombreado de tasa variable (VRS) [222]
    • Representación de subpíxeles y demura para uniformidad OLED
    • Hasta 1720,3 GFLOP FP32 (desde 1202,1 GFLOP en SD865)
    • Formatos de reproducción de vídeo HDR : HDR10 , HDR10+ , Dolby Vision , HLG
    • Juegos HDR (incluye profundidad de color de 10 bits, gama de colores Rec. 2020 )
    • Pantalla en el dispositivo: 4K a 60 Hz, QHD+ a 144 Hz
    • Pantalla externa: 4K a 60 Hz, 10 bits, Rec. 2020 , HDR10 , HDR10+
  • Características del DSP
    • Hexagon 780 con arquitectura Fused AI Accelerator, "motor de inteligencia artificial" de sexta generación, capaz de realizar 26 billones de operaciones por segundo (TOPS), desde 15 TOPS en 865.
      • Acelerador tensor hexagonal
      • Extensiones de vectores hexagonales
      • Acelerador escalar hexagonal
    • Qualcomm Sensing Hub (segunda generación)
      • Nuevo procesador de IA dedicado
      • Reducción del 80 % de la carga de trabajo gracias a Hexagon DSP
      • 5 veces más potencia de procesamiento
    • Memoria compartida 16 veces más grande
    • Mejora del tiempo de transferencia de 1000 veces en ciertos casos de uso [223]
    • Acelerador escalar 50% más rápido, acelerador tensorial 2 veces más rápido
    • Compatibilidad con reproducción de códecs de vídeo: H.264 (AVC) , H.265 (HEVC) , VP8 , VP9
  • Características del ISP:
    • Qualcomm Spectra 580 con triple CV-ISP de 14 bits y acelerador de hardware para visión artificial
    • Cámara única: 1x 200 MP o 84 MP a 30 fps con MFNR/ZSL (reducción de ruido de múltiples cuadros/retardo de obturación cero)
    • Cámara dual: 64+25 MP a 30 fps con MFNR/ZSL
    • Cámara triple: 3x 28 MP a 30 fps con MFNR/ZSL
    • Vídeo HDR 8K 30 FPS y 4K 120 FPS + Foto de 64 MP
    • Captura de video en cámara lenta a 720p a 960 FPS, 1080p a 480 FPS
    • Formatos de captura de video HDR : HEVC con HDR10 , HDR10+ , Dolby Vision , HLG
    • Captura de fotografías HDR : HDR HEIF de 10 bits
    • Captura de fotos y videos HDR computacional , compatibilidad con sensores HDR multifotograma y escalonado
    • Clasificación, segmentación y reemplazo de objetos en tiempo real
    • Enfoque automático, exposición automática y balance de blancos automático basados ​​en IA
    • Detección de rostros avanzada basada en hardware con filtro de aprendizaje profundo
    • Nueva arquitectura con poca luz (captura fotografías en 0,1 lux)
    • ISP de 2,7 gigapíxeles por segundo (aumento de velocidad del 35 % respecto del S865)
    • 120 fotos a 12 MP/s
  • Funciones del módem e inalámbricas:
    • Módem interno X60 5G
    • Modos: NSA, SA, TDD, FDD
    • 5G mmWave: ancho de banda de 800 MHz, 8 portadoras, MIMO 2×2
    • 5G sub-6 GHz: ancho de banda de 200 MHz, MIMO 4×4
    • Descarga 5G NR Sub-6 + mmWave: 7500 Mbit/s DL
    • 5G NR Sub-6 + mmWave subida: 3000 Mbit/s UL
    • Descarga LTE : 2500 Mbit/s DL (Cat. 24), CA 7x20 MHz, 1024-QAM, MIMO 4x4
    • Carga LTE : 316 Mbit/s UL (Cat 22), 3x20 MHz CA, 256-QAM
    • Uso compartido dinámico del espectro (DSS)
    • Bluetooth 5.2
      • Antenas duales [224]
      • Audio de primera calidad
    • Plataforma móvil compatible con Qualcomm Wi-Fi 6 :
      • Qualcomm FastConnect 6900
      • Estándares Wi-Fi : compatible con 802.11ax ( Wi-Fi 6E ), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Bandas espectrales de Wi-Fi: 2,4 GHz, 5 GHz, 6 GHz • utilización del canal: 20/40/80/160 MHz
      • Configuración MIMO : 2x2 (2 flujos espaciales) • MU-MIMO • Doble banda simultánea (DBS) (2×2 + 2×2)
      • Características principales: Sonido 8x8 (hasta 2 veces más que los dispositivos con sonido 4x4), Tiempo de activación objetivo para una eficiencia energética hasta un 67 % mejor, seguridad más reciente con WPA3
  • Otras características:

El Snapdragon 888+ se anunció el 28 de junio de 2021. [226]

Número de modeloNombre del productofabulosoTamaño del troquelUPCGPUProcesador de señal digital (DSP)Proveedor de servicios de InternetTecnología de memoriaMódemConectividadCarga rápidaDisponibilidad de muestras
APQ8074AA [227]Snapdragon 80028 nm (TSMC 28 HPM)4 núcleos hasta 2,26 GHz Krait  400Adreno 330 450 MHz (115,2 GFLOPS en FP32)Hexágono QDSP6 V5 600 MHzCámara única de hasta 21 MPLPDDR3 de doble canal, 32 bits, 800 MHz (12,8 GB/s)—Bluetooth 4.0 ; 802.11n / ac (2,4/5 GHz); IZat Gen8B2.0Segundo trimestre de 2013 [68]
MSM8274AA [227]Gobi 3G (UMTS)
MSM8674AA [227]Gobi 3G (CDMA/UMTS)
MSM8974AA [227]Gobi 4G ( LTE Cat 4: descarga hasta 150 Mbit/s, carga hasta 50 Mbit/s)
MSM8974AA versión 3 [157]Snapdragon 801Gobi 4G ( LTE Cat 4)Tercer trimestre de 2014
APQ8074AB v3 [157]4 núcleos hasta 2,36 GHz Krait  400Adreno 330 578 MHz [228] (150 GFLOPS en FP32)LPDDR3 de doble canal, 32 bits, 933 MHz (14,9 GB/s)—Cuarto trimestre de 2013
MSM8274AB [227]Snapdragon 800Gobi 3G (UMTS)Cuarto trimestre de 2013 [229]
MSM8674AB versión 3 [157]Snapdragon 801Gobi 3G (CDMA/UMTS)Segundo trimestre de 2013 [68]
MSM8974AB versión 3 [157]Gobi 4G ( LTE Cat 4)Cuarto trimestre de 2013
MSM8274AC versión 3 [157]4 núcleos hasta 2,45 GHz [230] Krait  400 [231]Gobi 3G (UMTS)Segundo trimestre de 2014 [68]
MSM8974AC versión 3 [157]Gobi 4G ( LTE Cat 4)Primer trimestre de 2014 [68]
APQ8084 [232]Snapdragon 8054 núcleos hasta 2,7 GHz Krait  450Adreno 420 600 MHz (153,6 GFLOPS en FP32)Hexágono V50 800 MHzCámara única de hasta 55 MPLPDDR3 de doble canal, 64 bits, 800 MHz (25,6 GB/s)ExternoBluetooth 4.1; 802.11n / ac (2,4/5 GHz); IZat Gen8BPrimer trimestre de 2014
MSM8992 [165] [233]Snapdragon 80820 nm (TSMC)2 + 4 núcleos (1,82 GHz Cortex-A57 + 1,44 GHz Cortex-A53 ) [234]Adreno 418 600 MHz [235] (153,6 GFLOPS en FP32)Hexágono V56 800 MHzCámara única de hasta 21 MPLPDDR3 de doble canal, 32 bits, 933 MHz (14,9 GB/s)X10  LTE ( Cat 9 : descarga hasta 450 Mbit/s, carga hasta 50 Mbit/s) [236]Bluetooth 4.1; 802.11ac; IZat Gen8CTercer trimestre de 2014 [237]
MSM8994 [169] [233]Snapdragon 8104 + 4 núcleos (2,0 GHz Cortex-A57 + 1,5 GHz Cortex-A53 ) [238]Adreno 430 600 MHz (230,4 GFLOPS en FP32)Cámara única de hasta 55 MPLPDDR4 de doble canal, 32 bits, 1600 MHz (25,6 GB/s)
MSM8994v2 [239]Adreno 430 630 MHz [239] (241,9 GFLOPS en FP32)2015 [239]
MSM8994v2.1 [240]Segundo trimestre de 2015
MSM8996
Lite [241]		Snapdragon 82014 nm FinFET (Samsung 14LPP)113,7 mm2 [ 242]2 + 2 cores Kryo (1.804 GHz + 1.363 GHz)Adreno 530 510 MHz (261.1 GFLOPS in FP32)Hexagon 680 1 GHzSpectraLPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)X12 LTE (download: Cat 12,

up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.)

Bluetooth 4.1; 802.11ac/ad; IZat Gen8C3.0Q1 2016
MSM8996[241]2 + 2 cores Kryo (2.15 GHz + 1.593 GHz)Adreno 530 624 MHz (319.5 GFLOPS in FP32)LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)Q4 2015
MSM8996
Pro-AB[243][244]		Snapdragon 821Q3 2016
MSM8996
Pro-AC[243][244][245]		2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz)Adreno 530 653 MHz (334.3 GFLOPS in FP32)
MSM8998[246]Snapdragon 83510 nm FinFET (Samsung 10LPE)72.3 mm24 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53)Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32)Hexagon 682Spectra 180LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS4.0Q2 2017[247]
SDM845[187]Snapdragon 84510 nm
FinFET (Samsung 10LPP)		95.0 mm24 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55)Adreno 630 710 MHz (727 GFLOPS in FP32)Hexagon 685
(3 TOPs)		Spectra 280X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)4+Q1 2018
SM8150[248]Snapdragon 8557 nm (TSMC N7)76.9 mm21 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55)Adreno 640 585 MHz (898.6 GFLOPS in FP32)Hexagon 690
(7 TOPs)		Spectra 380LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G[249] (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1Q1 2019
SM8150-AC[250]Snapdragon 855+1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55)Adreno 640 675 MHz (1036.8 GFLOPS in FP32)Q3 2019
Snapdragon 860Q1 2021
SM8150PSnapdragon 855+Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)Q3 2019
SM8250[251]Snapdragon 8657 nm (TSMC N7P)86.8 mm21 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)Adreno 650 587 MHz (901.6 GFLOPS in FP32)Hexagon 698
(15 TOPs)		Spectra 480LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or
LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)		Internal: no + External : X55 5G[252] (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1Q1 2020
SM8250-AB[253]Snapdragon 865+1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)Adreno 650 670 MHz (1029.1 GFLOPS in FP32)FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1Q3 2020
SM8250-AC[254]Snapdragon 8701 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55)FastConnect 6800; Bluetooth 5.2;[255] 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1Q1 2021
SM8350[256]Snapdragon 8885 nm (Samsung 5LPE)112.2 mm21 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)Adreno 660 840 MHz (1290.2 GFLOPS in FP32)Hexagon 780
(26 TOPs)		Spectra 580LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)Internal: X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.15Q1 2021
SM8350-AC[257]Snapdragon 888+1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55)Hexagon 780
(32 TOPs)		Q3 2021

Snapdragon 8/8+ Gen 1 (2022)

The Snapdragon 8 Gen 1 was announced on November 30, 2021.[258]

Notable features over its predecessor (888):

  • 4 nm (Samsung 4LPX) process
  • ~ billion transistors
  • Support up to 16 GB LPDDR5 3200 MHz
  • Quick Charge 5 (100 W+)
  • Support UFS 3.1
  • CPU features
  • GPU features
    • Adreno 730 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
    • 30% faster graphics rendering and 25% more power efficient[259]
    • Up to 1024 ALU (From 768 on Adreno 660)
    • Demura and subpixel rendering for OLED uniformity
    • Variable Rate Shading Pro
    • HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
    • HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
    • On-device display: 4K@60 Hz, QHD+@144 Hz
    • External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
  • DSP features
    • Hexagon with Fused AI Accelerator, INT8 and INT16
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
    • Qualcomm Sensing Hub (3nd generation)
      • New dedicated AI pro
  • ISP features[260]
    • Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
    • Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
    • Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
    • Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
    • 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
    • Slow-m 5G NR, LTE including CBRS
    • WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
    • 720p @ 960 FPS
    • HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
    • HDR photo capture: 10-bit HDR HEIF
    • Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
    • Real-time object classification, segmentation, and replacement
    • AI-based auto-focus, auto-exposure and auto-white-balance
  • Modem and wireless features:
    • Internal X65 5G Modem
    • Modes: NSA, SA, TDD, FDD
    • 5G mmWave
    • 5G sub-6 GHz
    • 5G NR Sub-6 + mmWave download: 10 Gbit/s
    • 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed)[261]
    • LTE download: 2.5 Gbit/s
    • LTE upload: 0.316 Gbit/s
    • Dynamic Spectrum Sharing (DSS)
    • Bluetooth 5.3
      • Qualcomm Aqstic audio codec (WCD9385)
      • Provide lossless wireless audio with Qualcomm aptX Technology.
    • Qualcomm Wi-Fi 6-ready mobile platform:
      • Qualcomm FastConnect 6900
      • Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
      • Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
      • MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
      • Peak speed: 3.6 Gbit/s[260]

The Snapdragon 8+ Gen 1 was announced on May 20, 2022.[143]

Model numberProduct NameFabDie sizeCPU (ARMv9)GPUDSPISPMemory technologyModemConnectivityQuick ChargeReleased
SM8450[262]Snapdragon 8 Gen 14 nm (Samsung 4LPX)128.5 mm2[242]1x 3.0 GHz Kryo Prime (Cortex-X2) +
3x 2.5 GHz Kryo Gold (Cortex-A710) +
4x 1.8 GHz Kryo Silver (Cortex-A510)		Adreno 730 818 MHz (1675.3 GFLOPs in FP32)Hexagon
52 TOPS, some cases up to 104 TOPS		SpectraLPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s)Internal: X65 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.15Q4 2021[258]
SM8475[263]Snapdragon 8+ Gen 14 nm (TSMC N4)102.6 mm2Adreno 730 900 MHz (1843.2 GFLOPS in FP32)Q2 2022[264]
1x 3.2 GHz Kryo Prime (Cortex-X2) +
3x 2.75 GHz Kryo Gold (Cortex-A710) +
4x 2.0 GHz Kryo Silver (Cortex-A510)

Snapdragon 8 Gen 2 (2023)

The Snapdragon 8 Gen 2 was announced on November 15, 2022.[265]

Notable features over its predecessor (8 Gen 1):

  • 4nm (TSMC N4) process
  • Support up to 16 GB LPDDR5X 4200 MHz
  • Support UFS 4.0
  • CPU features
  • GPU features
    • Adreno 740 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
    • 25% faster graphics rendering and 45% more power efficient
    • Up to 1536 ALU (From 1024 on Adreno 730)
    • Real-time hardware-accelerated ray tracing
      • ray-box and ray-triangle intersections
      • Bounding Volume Hierarchical (BVH)
    • Doubled bandwidth between ISP, Hexagon DSP, and Adreno GPU
  • DSP features
    • Hexagon with Fused AI Accelerator
      • Hexagon Tensor Accelerator
      • Hexagon Vector eXtensions
      • Hexagon Scalar Accelerator
      • Mixed precision INT8/INT16
      • Add INT4 support [266]
      • INT4, INT8, INT16, FP16 support
      • Hexagon Direct Link (ISP and Hexagon)
    • Qualcomm Sensing Hub (4th generation)
      • Add second AI processor
      • x2 performance from last year
      • Dedicated power delivery system[266]
      • 50% more memory
  • ISP features
    • Video capture up to 8K30 or 4K120 or 720p960 (HDR)
    • Video playback up to 8K60 or 4K120 (HDR)
    • H.264, H.265, VP9 and add AV1 decoding [266]
    • Photo is same as 8 Gen 1
  • Modem and wireless features:

There is an overclocked variant of the Snapdragon 8 Gen 2 with model number SM8550-AC. It was exclusive to the Samsung Galaxy S23 series on launch. Nubia's Red Magic 8S Pro became the first non-Galaxy phone to feature this variant,[267] launching July 5th 2023.[268]

Model numberProduct NameFabDie sizeCPU (ARMv9)GPUDSPISPMemory technologyModemConnectivityQuick ChargeReleased
SM8550-AB[269]Snapdragon 8 Gen 24 nm (TSMC N4)118.4 mm2[242]1× 3.2 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) +
3× 2.0 GHz Kryo Silver (Cortex-A510)		Adreno 740 680 MHz (2089 GFLOPS in FP32)HexagonSpectraLPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[270]
or
FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[271][272]		5Q4 2022[265]
SM8550-ACSnapdragon 8 Gen 2 for Galaxy[a]1× 3.36 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) +
3× 2.0 GHz Kryo Silver (Cortex-A510)		Adreno 740 719 MHz (2208.8 GFLOPS in FP32)Q1 2023
  1. ^ Also known as "Leading Version".

Snapdragon 8/8s Gen 3 (2024)

The Snapdragon 8 Gen 3 was announced on October 24, 2023.[273]

Notable features over its predecessor (8 Gen 2):

  • Support for memory up to 4800 MHz (up from 4200 MHz)
  • CPU features
  • GPU features
  • DSP features
    • Hexagon NPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing.
  • ISP features
    • Photo expansion
    • Video Object Eraser
    • Night Vision video capture
    • Dolby HDR video capture
  • Modem and wireless features:

The Snapdragon 8s Gen 3 was announced on March 18, 2024.[274]

Model numberProduct NameFabDie sizeCPU (ARMv9)GPUDSPISPMemory technologyModemConnectivityQuick ChargeReleased
SM8650-AB[275]Snapdragon 8 Gen 34 nm (TSMC N4P)137.3 mm2[242]1× 3.30 GHz Kryo Prime (Cortex-X4) +
3× 3.15 GHz Kryo Gold (Cortex-A720) +
2× 2.96 GHz Kryo Gold (Cortex-A720) +
2× 2.27 GHz Kryo Silver (Cortex-A520)		Adreno 750 903 MHz (2774 GFLOPS in FP32)HexagonSpectraLPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)Internal: X75 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.15Q4 2023[273]
SM8650-ACSnapdragon 8 Gen 3 for Galaxy[a]1× 3.40 GHz Kryo Prime (Cortex-X4) +
3× 3.15 GHz Kryo Gold (Cortex-A720) +
2× 2.96 GHz Kryo Gold (Cortex-A720) +
2× 2.27 GHz Kryo Silver (Cortex-A520)		Adreno 750 1000 MHz (3072 GFLOPS in FP32)Q1 2024
SM8635[276]Snapdragon 8s Gen 31× 3.0 GHz Kryo Prime (Cortex-X4) +
4× 2.8 GHz Kryo Gold (Cortex-A720) +
3× 2.0 GHz Kryo Silver (Cortex-A520)		Adreno 735 1100 MHz (1689.6 GFLOPS in FP32)LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 6.5 Gbit/s, upload up to 3.5 Gbit/s)Q1 2024[274]
  1. ^ Also known as "Leading Version".

Snapdragon 8 Elite (2024)

The Snapdragon 8 Elite was announced on October 22, 2024.[277]

Model numberProduct NameFabDie sizeCPUGPUDSPISPMemory technologyModemConnectivityQuick ChargeReleased
SM8750-AB[278]Snapdragon 8 Elite3 nm (TSMC N3E)124.1 mm2[242]Oryon 2 + 6 cores

(4.32 GHz Prime cores + 3.53 GHz Performance core)

Adreno 830 1100 MHz (3379.2 GFLOPS in FP32)HexagonSpectra (320 MP Photo Capture / 108 MP single camera @30fps ZSL / 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR)LPDDR5X dual-channel 5300 MHzInternal: X80 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)FastConnect 7900; Bluetooth 6.0; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.15Q4 2024[277]

Mobile Compute Platforms

Snapdragon 835 and Snapdragon 850

The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.[185]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.[279] It is essentially an over-clocked version of the Snapdragon 845.

Model numberProduct NameFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
MSM8998[280]Snapdragon 835 Mobile PC Platform10 nm
(Samsung 10LPE)		Kryo 280 4 + 4 cores

(2.6 GHz + 1.9 GHz)

Adreno 540 710 MHz (363.5 GFLOPS in FP32)Hexagon 682Spectra 180 (Up to 32 MP camera / 16 MP dual)LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s)Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS4Q2 2018
SDM850[281]Snapdragon 850 Mobile Compute Platform10 nm
(Samsung 10LPP)		Kryo 385 4 + 4 cores

(2.96 GHz + 1.77 GHz)

Adreno 630 710 MHz (727 GFLOPS in FP32)Hexagon 685 (3 TOPS)Spectra 280

(192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM)4+Q3 2018

Snapdragon 7c/7c+ Compute Platforms

The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[282]
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.[283]
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.[284]

Model numberProduct NameFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
SC7180[285]Snapdragon 7c8 nm (Samsung 8LPP)Kryo 468 2 + 6 cores

(up to 2.4 GHz)

Adreno 618 825 MHz (422.4 GFLOPS in FP32)Hexagon 692 (5 TOPS)Spectra 255 (Up to 32 MP camera / 16 MP dual)LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s)Bluetooth 5; 802.11a/b/g/n/ac/ad/ax (Wi-Fi 6); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0Q1 2020
SC7180P[286]Snapdragon 7c Gen 2Kryo 468 2 + 6 cores

(up to 2.55 GHz)

Q2 2021
SC7280[287]Snapdragon 7c+ Gen 36 nm (TSMC N6)Kryo 4 Gold + 4 Silver cores

(Cortex-A78r1p1, up to 2.4 GHz) + Cortex-A55 r2p0 

Hexagon (6.5 TOPS)Spectra (64 MP single camera / 36+22 MP dual camera)LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)
LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)		Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s)FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSDQ1 2022

Snapdragon 8c Compute Platforms

The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[282]

Model numberProduct NameFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
SC8180[288]Snapdragon 8c7 nm (TSMC N7)Kryo 490 4 + 4 cores

(2.45 GHz + 1.80 GHz)

Adreno 675 590 MHzHexagon 690 (9 TOPS)Spectra 390

(192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)

+

External: X55 5G/LTE[252] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)

Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD4+Q1 2020

Snapdragon 8cx Compute Platforms

The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.[289][290][291]
Notable features over the Snapdragon 855:

  • 10 MB total cache (L3 + SLC)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express 4x
  • 112.05 mm2 die size[292]

The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.[293]
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.[284][294][295]

Notable features over the Snapdragon 888:

  • 8 MB L3 cache & 6 MB SLC (14 MB total cache)
  • 8x 16-bit memory bus, (68.3 GB/s)
  • NVM Express 4x
  • Built-in Microsoft Pluton TPM[296]
Model numberProduct NameFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
SC8180X[297]Snapdragon 8cx7 nm (TSMC N7)Kryo 495 4 + 4 cores

(2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55)

Adreno 680
585 MHz (1797.1 GFLOPS in FP32)		Hexagon 690 (9 TOPS)Spectra 390

(32 MP single camera /

16 MP at 30fps dual camera with MFNR/ZSL)[298]

LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.3 GB/s)

No internal modem

Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)		Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD4+Q3 2019
SC8180XP[299]Snapdragon 8cx Gen 2 5GKryo 495 4 + 4 cores

(3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55)

Adreno 690
660 MHz
(2027.5 GFLOPS in FP32)		No internal modem

Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)
or
X55 5G/LTE[252] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)		Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.4 Gbit/s, NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSDQ3 2020
SC8280[300]Snapdragon 8cx Gen 35 nm (Samsung 5LPE)Kryo 4 + 4 cores

(3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)[294]

Adreno 695
900 MHz
(3686.4 GFLOPS in FP32)		Hexagon (15 TOPS)[301]Spectra (24 MP at 30fps single camera with MFNR/ZSL)No internal modem

Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)		FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSDQ1 2022

Microsoft SQ Compute Platforms

The Microsoft SQ1 was announced on October 2, 2019.[302][303] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.[304]

Product NameFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
Microsoft SQ17 nm

(TSMC N7)

Kryo 495 4 + 4 cores

(3 GHz Cortex-A76 + 1.80 GHz Cortex-A55)

Adreno 685 590MHz (1812.5 GFLOPs in FP32)Hexagon 690 (9 TOPS)Spectra 390 (192 MP single camera /

22 MP at 30fps dual camera with MFNR/ZSL)

LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.2 GB/s)

No internal modem

Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM)		Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD4+Q4 2019
Microsoft SQ2Kryo 495 4 + 4 cores

(3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55)

Adreno 690 680MHz (2089 GFLOPs in FP32)Q4 2020
Microsoft SQ3[305][306]5 nm (Samsung 5LPE)Kryo 4 + 4 cores

(3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)

Adreno 695 900MHz (3686.4 GFLOPS in FP32)Hexagon (15 TOPS)[307]Spectra (24 MP at 30fps single camera with MFNR/ZSL)No internal modem

Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)		FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSDQ3 2022

Snapdragon X series

The Snapdragon X Elite was announced on October 24, 2023.[308]
The Snapdragon X Plus was announced on April 24, 2024.[309]

Model numberFabCPUGPUDSP/NPUISPMemory technologyModemConnectivitySampling availability
Snapdragon X Plus[310][311]
X1P-42-1004 nm (TSMC N4)Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz)Adreno X1-45 1107 MHz (1.7 TFLOPS)Hexagon (45 TOPS)Spectra (36 MP single camera)LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)		No internal connectivity

External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD		Mid-2024
X1P-46-100Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz)Adreno X1-45 (2.1 TFLOPS)
X1P-64-100Oryon 10 core (3.4 GHz)Adreno X1-85 1250 MHz (3.8 TFLOPS)Spectra (64 MP single camera / 36 MP dual camera)
X1P-66-100Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz)
Snapdragon X Elite[312][311]
X1E-78-1004 nm (TSMC N4)Oryon 12 core (3.4 GHz)Adreno X1-85 1250 MHz (3.8 TFLOPS)Hexagon (45 TOPS)Spectra (64 MP single camera / 36 MP dual camera)LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s)No internal modem

Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s)		No internal connectivity

External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD		Mid-2024
X1E-80-100Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz)
X1E-84-100Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz)Adreno X1-85 1500 MHz (4.6 TFLOPS)
X1E-00-1DEOryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)

Hardware codec supported

See: Qualcomm Hexagon

Wearable platforms

The Snapdragon Wear 1100 processor was announced May 30, 2016[313] for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.

The Snapdragon Wear 1200 processor was announced June 27, 2017[314] for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.

The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.[315] It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.

The Snapdragon Wear 2500 was announced on June 26, 2018.[316] It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.

The Snapdragon Wear 3100 was announced on September 10, 2018.[317] The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.

The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.[318] The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.

The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.[319] The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.

Model numberProduct NameFabCPUCo-processorGPUDSPMemory technologyModemConnectivitySampling availability
?Wear 1100[320]28 nm1 core up to 1.2 GHz Cortex-A7 (ARMv7)—Fixed Function GPULPDDR2Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s)Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDouQ2 2016[321]
Wear 1200[322]1 core up to 1.3 GHz Cortex-A7 (ARMv7)Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s)Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDouQ2 2017[323]
MSM8909w[324]Wear 2100[325]4 cores up to 1.2 GHz Cortex-A7 (ARMv7)Adreno 304HexagonLPDDR3 400 MHzX5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)Bluetooth 4.1[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDouQ1 2016[326]
Wear 2500[327]Q2 2018
Wear 3100[328]QCC1110 (1 core 50 MHz Cortex-M0)

3100 & 4100+ only

Q3 2018[329]
SDM429wWear 4100 and 4100+[330]12 nm + 28 nm4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A)Adreno A504 320 MHzHexagon QDSP6 V561x32 bit LPDDR3 750 MHzBluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDouQ2 2020[331]
SW5100W5 and W5+ Gen 1[332]4 nm + 22 nm4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A)QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55)

W5+ only

Adreno A702 1 GHzHexagon DSP V66K1x16 bit LPDDR4 2133 MHzIntegrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s)Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDouQ3 2022[333]
  1. ^ Bluetooth 4.2 for Wear 3100

Automotive platforms

The Snapdragon 602A,[334] for application in the motor industry,[335] was announced on January 6, 2014.
The Snapdragon 820A[336] was announced on January 6, 2016.

Model numberProduct NameFabCPUGPUDSPMemory technologyModemConnectivitySampling availability
8064-AU[337]Snapdragon 602A28 nm (TSMC 28LP)4 cores up to 1.5 GHz Krait 300 (ARMv7)Adreno 320 400 MHz
(76.8 GFLOPs)

(2048x1536 + 1080p external display)		Hexagon V40 600 MHzLPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s)External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS)Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 802.11n/ac (Wi-Fi 5) 2x2 (MU-MIMO)Q1 2014
MSM8996AU[338]Snapdragon 820A14 nm (Samsung 14LPP)Kryo 2 + 2 cores (2.15 GHz Gold + 1.59 GHz Silver) (ARMv8)Adreno 530 624 MHz
(319.4 GFLOPs)		Hexagon 680 1 GHzLPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s)Bluetooth 4.1; 802.11ac/ad (Wi-Fi 5); IZat Gen8CQ1 2016
SA6155P[339]11 nm (Samsung 11LPP)Kryo 4xx 2 + 6 coresAdreno 608/612
(110 GFLOPs)		HexagonLPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)Internal: noBluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8155P[340][341]Snapdragon 855A7 nm (TSMC N7)Kryo 485 1 + 3 + 4 cores (2.96 GHz Prime + 2.42 GHz Gold + 1.80 GHz Silver)Adreno 640 675 MHz
(1036.8 GFLOPs)		Hexagon 690
(>10 TOPS)		LPDDR4X Quad-channel 16-bit (64-bit)

2133 MHz (34.1 GB/s)[342]

Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBASQ1 2021
SA8195P[343][344]Kryo 495 4 + 4 cores

(Cortex-A76 + Cortex-A55)

Adreno 680 600 MHz
(1843.2 GFLOPs)		HexagonLPDDR4X Quad-channel 16-bit (64-bit)

2133 MHz (34.1 GB/s)[345]

Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8255P5 nm (Samsung 5LPE)Kryo 4 + 4 cores (2.35 GHz Prime + 2.35 GHz Gold)Adreno 663
HexagonLPDDR5 Hexa-channel 16-bit (96-bit)

3200 MHz (76.8 GB/s)

Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS
SA8295PKryo 695 4 + 4 cores (2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78)Adreno 695Hexagon
(30 TOPS)		LPDDR4X Octa-channel 16-bit (128-bit)

2133 MHz (68.2 GB/s)

Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 1.8 Gbit/s; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS2023

Embedded platforms

The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[346][347]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[348]

Model numberProduct NameFabCPUGPUDSPISPMemory technologyModemConnectivitySampling availability
APQ8016E[349]Snapdragon 410E28 nm (TSMC 28LP)4 cores up to 1.2 GHz Cortex-A53 (ARMv8)Adreno 306Hexagon QDSP6 V5 691 MHzUp to 13 MP cameraLPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s)noneBluetooth 4.0, 802.11n, GPS
APQ8064E[350]Snapdragon 600E4 cores up to 1.5 GHz Krait 300 (ARMv7)Adreno 320 400 MHzHexagon QDSP6 V4 500 MHzUp to 21 MP cameraDDR3/DDR3L Dual-channel 533 MHzBluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A
APQ8074[351]Snapdragon 800E28 nm (TSMC 28HPM)4 cores up to 2.3 GHz Krait 400 (ARMv7)Adreno 330
Hexagon QDSP6 V5Up to 55 MP cameraLPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0
APQ8094[352]Snapdragon 810E20 nm (TSMC 20SoC)4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8)Adreno 430 650 MHzHexagon V56 800 MHzUp to 55 MP cameraLPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)Bluetooth 4.1; 802.11ac; IZat Gen8C
APQ8096[353]Snapdragon 820E14 nm FinFET (Samsung 14LPP)2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8)Adreno 530Hexagon 680 825 MHzUp to 28 MP cameraLPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)Bluetooth 4.1; 802.11ac/ad; IZat Gen8C

Vision Intelligence Platform

The Qualcomm Vision Intelligence Platform[354] was announced on April 11, 2018.[355][356] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.

Model numberFabCPU (ARMv8)GPUDSPISPMemory technologyModemConnectivityQuick ChargeSampling availability
QCS603[357]10 nm (Samsung 10LPP)2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver)Adreno 615 (Quad HD + 4K Ultra HD external display)Hexagon 685Spectra 270 (Up to 24 MP camera / 16 MP dual)LPDDR4X 16-bit 1866 MHznoneBluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.14+
QCS605[358]8 cores up to 2.5 GHz Kryo 300Spectra 270 (Up to 32 MP camera / 16 MP dual)Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1

Home Hub and Smart Audio platforms

The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[359] was announced on June 14, 2017.[360]
The Qualcomm 212 Home Hub (APQ8009)[361] and Qualcomm 624 Home Hub (APQ8053)[362] were announced on January 9, 2018.[363]

The QCS400 Series was announced March 19, 2019.[364]

Model numberFabCPUGPUDSPISPAudioMemory technologyModemConnectivitySampling availability
APQ8009[365][359] (SDA212)[366]28 nm (TSMC 28LP)4 cores up to 1.3 GHz Cortex-A7 (ARMv7)Adreno 304 (HD)Hexagon 536Up to 16 MP cameraLPDDR2/3 Single-Channel 533 MHznoneBluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi
APQ8017[359]4 cores up to 1.4 GHz Cortex-A53 (ARMv8)Adreno 308 (Full HD)LPDDR3 Single-channel 667 MHz
APQ8053[367] (SDA624)[368]14 nm (Samsung 14LPP)8 cores up to 1.8 GHz Cortex-A53 (ARMv8)Adreno 506 (Full HD+)Hexagon 546Up to 24 MP camera / 13 MP dualLPDDR3
QCS403[369]Dual-core CPUnone2x Hexagon V6612x Audio Channels SupportedBluetooth 5.1;

802.11ax-ready, 802.11ac, 4x4 (MIMO);

Zigbee/15.4

Q1 2019
QCS404[370]Quad-core CPU
QCS405[371]Adreno 306 (Full HD+)
QCS407[372]32x Audio Channels Supported

Mixed Reality (MR) platforms

Snapdragon XR series

  • In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.[373]
  • The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865.[374][failed verification][375] It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
    • The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022,[376] and is used in the Meta Quest Pro.
  • On September 27, 2023 Qualcomm announced the Snapdragon XR2 Gen 2 Platform for MR and VR headsets.[377] Qualcomm claims 2.5x higher GPU and 8x better AI performance compared to its predecessor the XR2 5G. The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.[378] With the support of Wi-Fi 7 network throughput is increased by 60% while latency is decreased by 80%. The platform debuted on the Meta Quest 3.
    • The Snapdragon XR2+ Gen 2 Platform is an overclocked version of the XR2 Gen 2 announced on January 4, 2024.[379] The GPU frequency has been increased by 15% while the CPU frequency has been increased by 20% compared to the XR2 Gen 2. This enables a higher 4.3K resolution per-eye at 90 Hz and the processing of 12 or more concurrent cameras and sensors. This chip forms the basis of the XR headset and ecosystem jointly developed by Qualcomm, Samsung, and Google that has been announced at Galaxy Unpacked in February 2023.[380]
Product NameFabCPU (ARMv8)GPUDSPISPMemory technologyTrackingConnectivitySampling availability
XR1[381]10 nm (Samsung 10LPP)4x Kryo 385 Gold + 4x Kryo 385 SilverAdreno 615Hexagon 685SpectraLPDDR4X3DoF and 6DoF head and controller trackingWiFi 5 Bluetooth 5Q1 2019
XR2[382]7 nm (TSMC N7+)1x Kryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 SilverAdreno 650 (up to 2x 3K displays at 90 Hz)Hexagon 698Spectra (input from up to 7 cameras)Full 6DoF head and controller tracking, as well as hand and finger trackingWiFi 6 Bluetooth 5 5GQ1 2020
XR2+ Gen1[383]LPDDR5WiFi 6E Bluetooth 5.2 5GQ4 2022
XR2 Gen2[384]4 nm (Samsung 4LPX)[385]4x Kryo (2.36 GHz) + 2x Kryo (2.05 GHz)Adreno 740 (up to 2x 3K displays at 90 Hz)HexagonSpectra (input from up to 10 cameras)LPDDR5XWiFi 7 Bluetooth 5.3 5GQ4 2023
XR2+ Gen2[386]?Adreno 740 (up to 2x 4.3K displays at 90 Hz)HexagonSpectra (input from up to 12 cameras)Q1 2024

Snapdragon AR series

The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022.[387] It is intended for use in smart glasses.[388]
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses.[377] It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).

Gaming platforms

Snapdragon G series

In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.[389][390] The Razer Edge is the first device to use the platform.[391] The G3x Gen 1 is a based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters with higher clock speeds, and the same GPU with a higher clockspeed. Connectivity options also seem in line.[392]

In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.[393]

Product NameFabCPUGPUModemConnectivityDisplaySampling availability
G1 Gen 1[394]Un­knownKryo (8 core)Adreno A11—Wi-Fi 5, Bluetooth 5.0HD at 60 fpsQ4 2023
G2 Gen 1[395]Un­knownAdreno A21X62 5G/LTEWi-Fi 6/6E, Bluetooth 5.0FHD+ up to 144 fps
G3x Gen 1[396]5 nm (Samsung 5LPE)1x 3.0 GHz Kryo 680 Prime (Cortex-X1) +
3x 2.42 GHz Kyro 680 Gold (Cortex-A78) +
4x 1.80 GHz Kyro 680 Silver Cortex-A55)		Adreno 660 900 MHz
(1382.4 GFLOPs in FP32)		X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/sQ1 2023
G3x Gen 2[397][398]4 nm (TSMC N4)1× 3.36 GHz Kryo Prime (Cortex-X3) +
4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) +
3× 2.02 GHz Kryo Silver (Cortex-A510)		Adreno A32 1000 MHz
(3072 GFLOPS in FP32)		X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/sQ4 2023

Bluetooth SoC platforms

Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.[399][400] Qualcomm announced the QCC5100 Series at CES 2018.[401]

On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[402][403] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[404] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.[405][406]

Qualcomm QCC300x Series Bluetooth audio SoCs

Model numberFabCPUDSPBluetoothTechnologies supportPower consumptionDAC output / Digital microphone inputSampling availability
QCC3001[407]RISC application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP (Up to 80 MHz)Bluetooth 5.0

Dual-mode Bluetooth

TrueWireless Stereo

cVc audio

Mono / 2-mic
QCC3002[408]TrueWireless Stereo

aptX Classic/HD/LL

cVc audio

QCC3003[409]cVc audioStereo / 1-mic
QCC3004[410]Stereo / 2-mic
QCC3005[411]aptX Classic/HD/LL

cVc audio

Qualcomm QCC30xx Series Bluetooth audio SoCs

Model numberFabCPUDSPBluetoothTechnologies supportPower consumptionDAC output / Digital microphone inputDigital Assistant activationSampling availability
QCC3020[412]Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

~6mA (2DP streaming)Mono / 2-micButton pressH1 2017
QCC3021[413]Stereo / 1-mic
QCC3024[414]cVc audio

Google Fast Pair

Stereo / 2-mic
QCC3026[415]aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Mono / 2-mic
QCC3031[416]aptX Classic/HD/LL

TrueWireless Stereo Plus

cVc audio

Stereo / 1-mic
QCC3034[417]aptX Classic/HD/LL

cVc audio

Google Fast Pair

Mono / 2-mic
QCC3040[418]Dual core 32-bit application processor

(Up to 80 MHz)

Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[402][403] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Bluetooth speed: 2 Mbit/s

aptX Classic/HD

TrueWireless mirroring

ANC (Feedforward/feedback and hybrid)

cVc audio

Google Fast Pair

<5 mAStereo / 2-micButton pressH1 2020
QCC3046[419]<5 mA

Qualcomm QCC510x Series Bluetooth audio SoCs

Model numberFabCPUDSPBluetoothTechnologies supportPower consumptionDigital Assistant activationSampling availability
QCC5120[420]Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.0

Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth

Bluetooth Speed: 2 Mbit/s

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback and Hybrid)

cVc audio

Google Fast Pair

~6mA (2DP streaming)

~7mA HFP Narrow Band, 1 Digital MIC cVc

Button press

Qualcomm Voice Activation

H1 2018
QCC5121[421]
QCC5124[422]
QCC5125[423]Single core Qualcomm Kalimba DSP

(Up to 120 MHz)

aptX Classic/HD/LL

eXtension program

TrueWireless Stereo Plus

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~10mA (2DP streaming)

~10mA HFP Narrow Band, 1 Digital MIC cVc

Button press
QCC5141[424]Dual core 32-bit application processor

(Up to 80 MHz)

Dual core Qualcomm Kalimba DSP

(Up to 120 MHz)

Bluetooth 5.2[402][403] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth

Speed: 2 Mbit/s

aptX Adaptive

eXtension program

TrueWireless Mirroring

ANC (FeedForward/Feedback)

cVc audio

Google Fast Pair

~5mA A2DP streamButton press

Qualcomm Voice Activation

H1 2020
QCC5144[425]

See also

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  271. ^ "Samsung Galaxy S23 Plus".
  272. ^ "Samsung Galaxy Z Fold5".
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  301. ^ 29 TOPS for the SoC
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  307. ^ 29 TOPS for the SoC
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  320. ^ "Snapdragon Wear 1100 Processor". Archived from the original on September 10, 2017. Retrieved September 10, 2017.
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  322. ^ "Snapdragon Wear 1200 Processor". Archived from the original on September 10, 2017. Retrieved September 10, 2017.
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  341. ^ "SA8155P Automotive Development Platform - Thundercomm".
  342. ^ up to 68.2 GB/s with UBWC Gen 3 compression
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  344. ^ "SA8155P Automotive Development Platform - Thundercomm".
  345. ^ up to 68.2 GB/s with UBWC Gen 3 compression
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  358. ^ "Qualcomm QCS605 SoC". Qualcomm. Archived from the original on August 1, 2018. Retrieved July 21, 2018.
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  379. ^ "Qualcomm Accelerates New Wave of Mixed Reality Experiences with Snapdragon XR2+ Gen 2". Qualcomm. San Diego, California. January 4, 2024. Retrieved January 5, 2024.
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  385. ^ 骁龙XR2+GEN2 高通XR平台芯片拆解 sxr2230p, 24 Sep 2024
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  394. ^ "Snapdragon G1 Gen 1 Gaming Platform". Retrieved August 24, 2023.
  395. ^ "Snapdragon G2 Gen 1 Gaming Platform". Retrieved August 24, 2023.
  396. ^ "Snapdragon G3x Gen 1 Gaming Platform". Retrieved December 1, 2022.
  397. ^ "Snapdragon G3x Gen 2 Gaming Platform". Retrieved August 24, 2023.
  398. ^ "Official Release of AYANEO Pocket S, High-End Flagship Android Handheld Featuring the Snapdragon G3x Gen 2 Gaming Platform… - AYANEO".
  399. ^ "Amazon.com, Qualcomm to put Alexa assistant in more headphones". Reuters. October 23, 2018. Archived from the original on October 4, 2019. Retrieved May 19, 2019.
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  404. ^ "LE Audio: A new age of Bluetooth audio sharing". Qualcomm. January 27, 2020. Archived from the original on January 29, 2020. Retrieved January 29, 2020.
  405. ^ "New Ultra-Low Power Bluetooth Audio SoCs From Qualcomm Improve Truly Wireless Sound". Qualcomm. March 25, 2020. Archived from the original on March 27, 2020. Retrieved March 27, 2020.
  406. ^ "New audio technologies help bring out the best in truly wireless earbuds". Qualcomm. March 25, 2020. Archived from the original on March 27, 2020. Retrieved March 27, 2020.
  407. ^ "QCC3001". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
  408. ^ "QCC3002". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
  409. ^ "QCC3003". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
  410. ^ "QCC3004". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
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  413. ^ "QCC3021". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
  414. ^ "QCC3024". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
  415. ^ "QCC3026". Qualcomm. October 2, 2018. Archived from the original on January 15, 2020. Retrieved May 19, 2019.
  416. ^ "QCC3031". Qualcomm. October 2, 2018. Archived from the original on March 27, 2020. Retrieved May 19, 2019.
  417. ^ "QCC3034". Qualcomm. October 2, 2018. Archived from the original on March 27, 2020. Retrieved May 19, 2019.
  418. ^ "QCC3040 | Entry-Level TrueWireless Bluetooth Audio BGA SoC". Qualcomm. March 17, 2020. Archived from the original on March 27, 2020. Retrieved March 27, 2020.
  419. ^ "QCC3046 | Mid-Level TrueWireless Bluetooth Audio WLCSP". Qualcomm. March 19, 2020. Archived from the original on March 27, 2020. Retrieved March 27, 2020.
  420. ^ "QCC5120". Qualcomm. October 2, 2018. Archived from the original on July 11, 2019. Retrieved May 19, 2019.
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  425. ^ "QCC5144 Chipset | Premium BGA package for TrueWireless Earbuds". Qualcomm. March 19, 2020. Archived from the original on March 27, 2020. Retrieved March 27, 2020.
  • Media related to Snapdragon (microprocessor) at Wikimedia Commons
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